Surface Technology Systems Silicon Etcher Multiplex

Title: Surface Technology Systems Silicon Etcher Multiplex
Company: Capovani Brothers Inc.
Location: Scotia, NY, USA
Email: cbi@capovani.com
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Description:

CINCINNATI SUB-ZERO 

THERMAL SHOCK CHAMBER -75°C TO 371° C

Manufacturer

Surface Tech Sys

Model

MXP Multiplex ICP ASE HR

Wafer Size Range

    Minimum

50 mm

    Maximum

200 mm

    Set Size

150 mm

Process

Silicon Etch Bosch Process

Loadlock

    Loadlock Yes/No

YES

    Loadlock Pump Manufacturer & Model

Edwards E2M40

High Vacuum Pump

Pfeiffer MAG 2000

Roughing Pump

Edwards IQMB250 & IQDP80

RF Generator Model

ENI/ACG-3B and Advanced Energy RFG 3001

Number of Gas Inputs

Four Gas

Process Gases

SF6, C4F8, O2, Ar

Chillers

    Number of Chillers

1

    Chiller #1Manufacturer/Model

Huber/Unistat 140W

Accessories

ICP V2 - Balun coil
Carousel in MkIV MPX - 2 x 150mm wafers
3KW Source
300/30W platen
E-Rack Modules: HCL1 +HCU3 +HCU5+VAC3Y +2x AMC1 +HBC2

Other Information

Windows 2000
Bosch license
Current Power Requirements: 400V , 50Hz, 40 Amp, 3 phase
Unit can be configured for: 208/460, 60 Hz, 3 Phase. Please request at time of purchase.

CE Marked

YES

Year of Manufacture

2003

Close Date: March 30, 2015
Phone: Capovani Brothers Inc. / +1 (518) 346-8347
Email: cbi@capovani.com
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