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Trion Technology ICP Oxide Etcher Oracle

Title: Trion Technology ICP Oxide Etcher Oracle
Company: Capovani Brothers Inc.
Location: Scotia, NY, USA
Email: cbi@capovani.com
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Description:

CINCINNATI SUB-ZERO THERMAL SHOCK CHAMBER -75°C TO 371° C

Manufacturer

Trion Technology

Model

Oracle

Wafer Size Range

    Minimum

50 mm

    Maximum

200 mm

    Set Size

200 mm

Number of Chambers

1

Process Capabilities

Oxide Etch

Chamber 1 Description

RIE Dielectric Etch
Phantom III RIE Reactor

Controller Type

PC Controller Type

Process Gases

CF4, CHF3, Ar, O2

Other Information

Central Vacuum
Transport (CVT) Platform
High Conductance Plenum and Vacuum System
Manual Wafer Load Port
Automatic Pressure Control
600 Watt, 13.56 MHz RF Generator
DC Bias Control
Brooks Automation VCE6 Vacuum Cassette Elevator
(2) Ebara ESR20N 2,000 LPM Dry Pumps,

Year of Manufacture

2006

Close Date: March 30, 2015
Phone: Capovani Brothers Inc. / +1 (518) 346-8347
Email: cbi@capovani.com
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