EV Group Bench Top Anodic Wafer Bonder EVG AB1-PV

Title: EV Group Bench Top Anodic Wafer Bonder EVG AB1-PV
Company: Capovani Brothers Inc.
Location: Scotia, NY, USA
Email: cbi@capovani.com
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Description:

ManufacturerEVG
ModelAB1-PV
DescriptionAnodic Wafer Bonder
Wafer Size Range
  Minimum50 mm
  Maximum125 mm
AccessoriesBalzers TPH 062 turbo pump
Balzers TCP015 turbo pump controller
Leybold Combivac CM31 gauge controller
Other InformationHeater: 130mm diameter
Power Requirements220 V     50 Hz     1 Phase
Exterior Dimensions
  Width30.000  in  (76.2 cm)
  Depth20.000  in  (50.8 cm)
  Height26.000  in  (66.0 cm)
Weight220  lb  (100 kg)
Close Date: August 16, 2015
Phone: Capovani Brothers Inc. +1 (518) 346-8347
Email: cbi@capovani.com
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