The thin layer deposition equipment industry is highly competitive and capital-intensive.
Technology and timing are the critical success factors that are carving up the
industry landscape. Companies with strategically maneuvered technology investments
are leaping forward, while others bogged down by discontinuous technology investments
are witnessing plummeting shares. As the cutthroat dynamics operating in the
industry shorten product life cycles and soften industry pricing, market shares
are under pressure, with winds of change blowing in favor of technology innovators,
who are also the industry's prime movers. In other words, market leaders with
no significant interest in next generation technologies are likely to fall flat
and stake their leadership to zealous companies fervently venturing to commercialize
new thin film product chemistries and deposition technologies.
North America, Europe and Asia-Pacific account for over 85% of the global thin
layer deposition equipment market, as stated by Global Industry Analysts, Inc.
Thin layer deposition is seeking newer markets and is continuously evolving
to reach new heights leveraging on its proven abilities to offer desired engineering/chemical/optical
properties that enhance functionality and longevity of the substrate/tool and
as a unique solution to metal layer deposition in highly sophisticated applications
such as atomic layer deposition, gold film for lenses and mirrors. The US physical
vapor deposition equipment market is expected to witness the strongest growth
and reach US$2.4 billion by 2010. chemical vapor deposition equipment market
in Asia-Pacific is expected to witness a CAGR of 14.4% over the period 2001-2010.
Thin layer deposition (TLD) equipment makers are fairly concentrated in the
microelectronics industry, with majority of their businesses vested with the
semiconductor fabrication industry. The industry accounts for a gigantic share
of the total TLD equipment industry's revenues. However, the industry, prone
to frequent disruptions arising in sync with economic fortunes of the markets,
is severely hurting the profitability and order bookings of the TLD equipment
industry. For long, TLD equipment makers have fruitlessly restricted their target
market to the semiconductor industry, where equipment spending is often governed
by host of economic and commercial factors, not taking much note of revolutionary
improvements accomplished in technology.
Unlike the diversified Physical Vapor Deposition (PVD) industry, the Chemical
Vapor Deposition (CVD) industry is much more concentrated on high-tech applications
of microelectronic components such as semiconductors and opto-electronic components,
aerospace and medical technology. Realizing the physical and technological limitations
of PVD in the microelectronics industry, PVD equipment makers have largely diversified
into a variety of end-use segments such as information storage, optics, medical
instruments, industrial coatings, automotive and aerospace components and specialty/flexible
packaging, where they race ahead of CVD technologies in terms of cost efficiency
and coating volumes. Whereas, CVD zooms ahead of PVD technologies in terms of
sophistication, innovation, extended functionality in the microelectronic industry,
despite shrinking feature sizes and in terms of premium value accorded by the
end-users.
The report titled "Thin Layer Deposition Equipment: A Global Strategic
Business Report" published by Global Industry Analysts, Inc., provides
a comprehensive review of market trends, product overview, key markets worldwide,
product introductions/innovations, and recent industry activity. The report
analyzes market data and analytics in value sales for the period 1991-2015,
for regions such as the United States, Canada, Japan, Europe, Asia-Pacific,
Middle East, and Latin America. The study also analyzes the PVD equipment market
by the following end-use applications - Microelectronics, Cutting Tools, Industrial,
Specialty Packaging, Storage, Optics, and Medical Applications; and the CVD
equipment market by the following end-use applications - Cutting Tools, Industrial,
and Medical Applications.
Major market participants include AIXTRON, Applied Materials, Inc., ASM International
N.V., Axcelis Technologies, Inc., Canon ANELVA Corporation, CHA Industries,
CVD Equipment Corporation, Denton Vacuum, Edwards Limited, Ibis Technology Corporation,
Implant Sciences Corporation, Ionbond AG, Jusung Engineering Co., Ltd., KDF
Electronic & Vacuum Services, Inc., Kokusai Semiconductor Equipment Corporation,
Kookje Electric Korea Co., Ltd., Novellus Systems, Inc., OC Oerlikon Corporation
AG, RIBER SA, Seki Technotron USA, SEN Corporation, Silicon Genesis Corporation,
Tecvac Limited, Tegal Corporation, Ti-Coating, Inc., Tokyo Electron Limited,
Ultramet, ULVAC Technologies, Inc., Vapor Technologies, Inc., and Veeco Instruments.
For more details about this research report, please visit http://www.strategyr.com/Thin_Layer_Deposition_Equipment_Market_Report.asp.
Posted November 10th, 2008
