TriboIndenter - Nanomechanical Test Instruments From Hysitron Incorporated

Topics Covered

Background

Full Featured

Testing Modes

Standard

Upgrade Options

Automation

Stability

Highlights

Application Range

Sizes

Thickness

Moduli

Hardness

Structure

Background

The TriboIndenter has been developed as an automated, high-throughput instrument that is built on a single platform designed to support the numerous quantitative nanomechanical characterization techniques developed by Hysitron.

Hysitron’s instruments have been engineered from the beginning to provide true nanoscale measurements with high precision and accuracy, making it the premier instrument for true nanomechanical testing.

The plethora of testing methods offered by Hysitron make the TriboIndenter the most versatile nanomechanical characterization tool available for scientists and engineers.

Full Featured

The TriboIndenter brings unprecedented capabilities to nanomechanical testing. The TriboIndenter incorporates Hysitron’s patented three-plate capacitive transducer technology known for its sensitivity and stability along with superior staging design to deliver outstanding performance in nanomechanical characterization. The versatile design of the TriboIndenter platform has enabled the range of testing to be extended from fundamental nanoscale testing to true microindentation and microscratching.

The diversity of techniques, such as TriboAE® and nanoDMA®, makes the TriboIndenter an invaluable tool for a wide range of materials and applications.

AZoNano - The A to Z of Nanotechnology - The TriboIndenter shown enclosed in the engineered acoustic/thermal isolation unit, which provides the stability needed for 24hour/day operation

Figure 1. The TriboIndenter shown enclosed in the engineered acoustic/thermal isolation unit, which provides the stability needed for 24hour/day operation.

AZoNano - The A to Z of Nanotechnology - Hysitron TriboIndenter shown with scanner, standard magnetic stage and top-down optics

Figure 2. Hysitron TriboIndenter shown with scanner, standard magnetic stage and top-down optics.

Testing Modes

Standard

Standard testing modes include quasistatic testing, nanoscratch testing and ScanningWear.

•        Quasistatic testing: Determine Young’s modulus, hardness, fracture toughness and other mechanical properties via indentation.

•        Nanoscratch testing: Quantify scratch resistance, critical delamination forces, friction coefficients and more with true nanoscale normal and lateral force and displacement monitoring.

•        ScanningWear®: Observe and quantify wear volumes and wear rates using the in-situ SPM imaging capability.

Upgrade Options

Upgrade options include nanoDMA, modulus mapping, 3D OmniProbe, feedback control, TriboAE, AFM, multi-Range nanoprobe, thermal control and vacuum chuck.

•        nanoDMA®: Investigate time-dependent properties of viscoelastic materials using a dynamic testing technique designed for polymers and biomaterials.

•        Modulus Mapping: Quantitatively map the storage and loss stiffness and moduli over an area from a single SPM scan.

•        3D OmniProbe®: Increased scratch lengths and forces for micro-scratching, tribology and interfacial adhesion measurements.

•        Feedback Control: Operate in closed loop load or displacement control to perform testing techniques such as creep, stress relaxation and adhesion tests.

•        TriboAE®: Monitor fracture, delamination and phase transformations that occur under nanoscale contacts.

•        AFM: Provides ultra-low contact force and intermittent contact imaging modes for standard AFM imaging of soft polymers and biomaterials.

•        Multi-Range Nanoprobe: Provides loads of up to 10N for fracture and depth-sensing micro-indentation studies.

•        Thermal control: Heating/cooling stages can be added for investigation of mechanical properties at non-ambient temperatures.

•        Vacuum Chuck: Wafer mounting system that eliminates necessity of gluing or cutting wafers.

AZoNano - The A to Z of Nanotechnology - Depth profile of a 1μm low-k film with a modified surface layer using nanoDMA

Figure 3. Depth profile of a 1μm low-k film with a modified surface layer using nanoDMA.

AZoNano - The A to Z of Nanotechnology - In-situ SPM image of a fracture toughness test on a low-k material

Figure 4. In-situ SPM image of a fracture toughness test on a low-k material.

AZoNano - The A to Z of Nanotechnology - 10μm modulus map of an Al/Si composite material

Figure 5. 10μm modulus map of an Al/Si composite material.

Automation

Hysitron has developed a Windows compatible, user friendly software package that is easy to learn and use.

The software provides both pre-programmed and user definable automation routines for customizable high throughput testing. Automatic analysis and summaries of testing results minimize user time and intervention.

In-situ SPM imaging Hysitron pioneered in-situ SPM imaging for nanoindentation, the capability to image the sample with the same tip used for testing. In addition to unsurpassed tip placement resolution, in-situ imaging provides the capability to obtain SPM images of the sample surface immediately before and after testing to verify test position and observe material deformation.

Stability

Potential detriments to test stability and accuracy, such as ambient noise and vibrations, are dampened through both active and passive dampening. The piezoelectric active dampening and the acoustic/thermal isolation unit, accompanied by the stable transducer design, ensure that the TriboIndenter provides the shortest stabilization time and most reliable data of any nanoindenter available.

Highlights

•        Automated testing for high throughput and statistical sampling of materials.

•        In-situ imaging provides nanometer precision test positioning and the convenience of SPM topography on any size sample, as well as multiple samples.

•        Numerous upgrade options that allow the widest array of quantitative testing capabilities on the market.

•        Acoustic and thermal enclosure, along with stable transducer design, minimizes set-up and stabilization time.

•        Active and passive vibration dampening systems ensure low noise and uncompromised sensitivity.

•        Top-down optics for macroscopic viewing and selection of testing sites.

•        Sub-micron resolution staging for sample positioning.

•        Offline image analysis software for quantitative analysis and generation of presentation-grade images.

Application Range

Sizes

300 mm wafers to fibers to nanoparticles.

Thickness

Bulk materials to multi-layered films to ultra-thin 3 nm films.

Moduli

Diamond to low-k materials to biological tissue.

Hardness

Cubic Boron Nitride to copper to polymers.

Structure

Bulk materials, multi-phase materials, MEMS devices, nanostructured materials.

Source: Hysitron Incorporated

For more information on this source please visit Hysitron Incorporated

 

Date Added: Sep 29, 2006 | Updated: Jun 11, 2013
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