Topic List
Background
The New Industry Standard
New Capabilities for More Applications
3D Mapping and Automation Packages
Larger Samples and Longer Scans
Superior Repeatability
Larger Vertical Range
Powerful, Easy-To-Use Software
Microform Measurements, Lowest Stylus Force
Customized For Your Applications
Dektak 150 Specification
System
Performance
Environment
Dimensions
Power Requirements
Background
The Dektak® XT Surface Profiler is the culmination of over three decades of stylus profiler technology innovations. The system boasts the industry’s best performance, best repeatability, and largest standard scanning range, while offering a variety of configurations and add-on options for superior programmability, low-force characterization, and detailed analysis. Simply stated, there has never been a more powerful profiler at a better price.
Figure 1. Dektak Surface Profiler
The New Industry Standard
Largest standard Z range of 524 microns enables larger step measurements Optional X-Y automated stage delivers programmability of over 200 locations Optional Y automated stage offers 3D mapping capability Cast aluminum frame and rigid support elements drastically improve repeatability and lower noise floor
New Capabilities for More Applications
Bruker’s newest stylus profiler system is available with three configurations to permit the best possible match to your research or industry application. The standard Dektak XT utilizes a new-design, 4 x 4-inch X-Y stage with manual theta.
3D Mapping and Automation Packages
The Dektak XT also can be configured with a 4-inch Y auto stage that enables 3D imaging. Or it can be equipped with a 6-inch X-Y auto stage that, in addition to 3D mapping, provides automation and programmability of over 200 sample sites.
Larger Samples and Longer Scans
The innovative design of the Dektak XT accommodates samples up to 3-inches thick, performs long scans of 55 millimeters, and provides a larger X-Y translation than competing systems. With the scan-stitching package, the system can perform even longer scans for stress measurements on larger wafers. Other stage features include wafer alignment pins for ease of use, three-point suspension for stress, lateral calibration for 99.9% accuracy, and a larger scan block for improved baseline stability.
Superior Repeatability
With 6-angstrom step-height repeatability, the Dektak XT profiler provides the flexibility to perform precise step-height measurements for thin films down to less than 100 angstroms, as well as thick-film measurements up to several hundred microns thick. The Low-Inertia Sensor 3 (LIS 3) head incorporates key technology advances to deliver extremely accurate measurements with unprecedented sensitivity.
Larger Vertical Range
The 512-micron vertical range is the best standard Z performance in the industry, and a 1-millimeter option extends the vertical range of these systems even further. The result of all these features is exceptional horizontal and vertical resolution, enabling precise planarity scans for measuring radius of curvature, flatness, and waviness, as well as characterizing thin-film stress on wafers.
Powerful, Easy-To-Use Software
The Windows® XP software interface allows the operator to quickly become a Dektak expert. Analysis functions are both comprehensive and intuitive, from simple one-button load-and-go testing to automatic comparisons of analytical results from multiple scans. The Vision® analysis package further extends the usefulness of the Dektak XT data, enabling true 3D mapping, bearing ratio, and over 200 additional analyses.
Microform Measurements, Lowest Stylus Force
The new MicroForm™ package reveals difficult shapes and overcomes steep slopes, improving accuracy to within 0.25°. Similarly, the Low-Force option improves stylus sensitivity to 0.03 milligrams to enable non-destructive characterization of delicate surfaces. Plus, additional analysis capabilities have been added, such as histogram and advanced automation program summary for pass/fail analysis.
Customized For Your Applications
Whatever your application, we can configure a system to meet your specific requirements. Metal etch uniformity on wafers Thin-film stress calculations Transparent films/photoresist thickness, thin- and thick-film measurements Large-step MEMS characterization Microlens height/curvature and V-groove depth analyses Roughness studies on machined parts Aspheric lens characterization Surface quality and defect review High aspect ratio trench depth measurements And much, much more!
Dektak XT Specification
System
- Measurement Technique - Stylus profilometry
- Measurement Capability - Two-dimensional surface profile measurements
- Sample Viewing - 640 x 480-pixel (1/3in.-format) camera, USB; fixed magnification, 2.6mm DFOV (166X with 17in. monitor); optional manual zoom, variable 0.67 to 4.29mm DFOV (644X to 100X with 17in. monitor)
- Stylus Sensor - Low-Inertia Sensor (LIS 3)
- Stylus Force - 1 to 15mg with LIS 3 sensor; 0.03 to 15mg with N-Lite sensor option
- Stylus Options - Stylus radius options from 50nm to 25μm; High Aspect Ratio (HAR) tips 10μm x 2μm and 200μmx 20μm
- Sample Stage - Manual X/Y/θ, 100 x 100mm X-Y translation, 360° rotation, manual leveling; optional Y auto stage, 100mm (4in.) travel, 1μm repeatability; optional X-Y auto stage, 150mm (6in.) travel, 1μm repeatability
- Computer System - PC with Pentium® D or AthlonTM processor
- Software - Dektak software running under Windows® XP; Step Detection software (std.); optional Stress Measurement software; optional 3D Mapping with Vision analysis software
- Vibration Isolation - Optional vibration isolation table; optional table-top vibration isolation system
Performance
- Scan Length Range - 55mm (2.16in.)
- Data Points Per Scan - 60,000 maximum
- Max. Sample Thickness - Up to 90mm (3.5in.), depending on configuration
- Max. Wafer Size - 150mm (6in.)
- Step Height Repeatability - 6Å, 1 sigma on 0.1μm step
- Vertical Range - 524μm (0.02in.) standard; 1mm (0.039in.) optional
- Vertical Resolution - 1Å max. (at 6.55μm range)
Environment
- Temperature Range - Between 18 and 24°C (64 to 75°F)
- Humidity Range - 60% ±20°C, non-condensing
Dimensions
- 292mm W x 508mm D x 527mm H (11.5in. W x 20in. D x 20.75in. H)
- Weight 34kg (75lbs.)
Power Requirements
- Input Voltage 100 to 120VAC/200 to 240VAC, 50 to 60Hz
This information has been sourced, reviewed and adapted from materials provided by Bruker AXS.
For more information on this source please visit Bruker AXS.