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Topic List
The XE-3DM Atomic Force Microscope from Park Systems
Features of The XE-3DM Atomic Force Microscope
Limitations of Conventional 3D AFMs
Flare Tip Limitations
Tilted Step-in Tip Limitations
Challenges with Accessing Sidewalls
The XE-3DM AFM vs. Conventional 3D AFMs
Complete 3D Metrology of Sidewalls using The XE-3DM AFM
High Resolution Imaging of Undercut and Sidewall Features Using The XE-3DM AFM
The XE-3DM Atomic Force Microscope from Park Systems
Continuing the Park Systems' impressive track record of developing optimized solutions, Park Systems introduces XE-3DM, an automatic AFM which revolutionizes the way trench, overhang, and undercut features are scanned and analyzed. The new XE-3DM also makes possible to image soft photoresist structures without deforming or damaging it.
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Features of The XE-3DM Atomic Force Microscope
Key features of XE-3DM Atomic Force Microscope include:
- Automated reference marker detection
- Automatic Data Acquisition and Analysis of Trench, Overhang, and Undercut Features
- High Resolution Access to Undercut and Sidewall
- Non-Destructive CD and Sidewall Measurements by True Non-Contact Mode
- Soft Photoresist Structures Can Be Imaged Non-Destructively
- Critical Angle Measurement of Sidewalls
- Automatic Tip Exchange (optional)
Limitations of Conventional 3D AFMs
Limitations of conventional 3D AFMs include:
- Flare Tip Limitations
- Tilted Step-in Tip Limitations
- Challenges in Accessing Sidewall
Flare Tip Limitations
- Flat and very wide bottom portion of the tip (>100nm)
- Unable to produce detailed image of sidewalls
- Limited accessibility to significant undercut samples
- Slow scan rate & low resolution
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Tilted Step-in Tip Limitations
- Essentially tilted piezotubescanning both XY & Z
- Point by point mapping
- Low & limited resolution due to "step-in" approach
- Very slow scan rate
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Challenges in Accessing Sidewalls
Conventional AFM cannot get access to the sidewall, especially for overhang features
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Other methods, such as the flare tips, are insufficient in obtaining the high resolution details of the sidewall due to its dull tip. For a deeper overhang, the bottom width cannot be reached at all.
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The XE-3DM AFM vs. Conventional 3D AFMs
Innovative XE-3DM technology overcomes the challenges and limitations in conventional 3D AFMs by offering high resolution access to undercut and sidewall
- Two independent XY and Z flexure scanners for sample and tip
- Z-scanner tilted sideway from -38° to +38°
- Access to overhang sidewall
- Use of normal high aspect ratio tips for high resolution imaging
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Complete 3D Metrology of Sidewalls using The XE-3DM AFM
XE-3DM offers complete 3D metrology of sidewall
- High Resolution Sidewall Roughnesss Measurement
- Critical Angel Measurement of Sidewalls
- Critical Dimension Measurements of Vertical Sidewalls
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High Resolution Imaging of Undercut and Sidewall Features Using The XE-3DM AFM
XE-3DM offers high resolution access to undercut and sidewall
- Unique decoupled XY and Z scanning system with tilted Z scanner
- Z-scanner is tilted sideways from -19 to +19 degrees and -38 to +38 degrees
- Use of normal high aspect ratio tips for high resolution imaging
- XY scan of up to 100 µm x 100 µm
- Up to 25 µm Z scan range by high force scanner
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Image of Undercut Overhang: Metal Overhang Structure
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Image of Sidewall Roughness Measurement
Source: Park Systems
For more information on this source please visit Park Systems