Microwave Plasma Processing Systems for the Semiconductor Industry

Toptics Covered

Background
Front-End Solutions for the Semiconductor Industry
Back-End Solutions for the Semiconductor Industry
Pre-Assembly Solutions for the Semiconductor Industry
About PVA Tepla

Background

PVA TePla AG specialize the design and manufacture of advanced Microwave Plasma Processing systems for silicon and compound semiconductors. These include:

  • HB-LED
  • Power devices
  • MEMS
  • PLED and
  • Solar cell manufacturing

Front-End Solutions for the Semiconductor Industry

PVA TePla supply front-end solutions such as batch and single wafer systems for photo resist ashing and descum, as well as removal of polymers, SU8 and sacrificial layers for MEMS fabrication.

Back-End Solutions for the Semiconductor Industry

PVA TePla's back-end/chip packaging applications include plasma cleaning and surface activation prior to wire bond and encapsulation for Flip Chip, stacked dies, MCM and advanced Cu lead frames.

Pre-Assembly Solutions for the Semiconductor Industry

PVA TePla can slo supply pre-assembly solutions for stress relief, Chip Side Healing (CSH) and passivation for ultra-thin wafer technologies with thicnesses as low as 25µm. Their wafer metrology tools offer unique stress/defect analysis (SIRD) and ion implantation monitoring (TWIN) for quality inspection on 300mm wafers in high volume manufacturing environments.

About PVA Tepla

PVA TePla is a world leading system engineering company. Their key technologies centre around systems for hard-metal sintering and crystal growing as well as the use of plasma systems for surface activation, functionalization, coating, ultra-fine cleaning and etching.

This information has been sourced, reviewed and adapted from materials provided by PVA Tepla.

For more information on this source, please visit PVA Tepla.

Date Added: May 24, 2011 | Updated: Jun 11, 2013
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