Toptics Covered
Background
Front-End Solutions for
the Semiconductor Industry
Back-End Solutions for the
Semiconductor Industry
Pre-Assembly Solutions for the
Semiconductor Industry
About PVA Tepla
Background
PVA TePla
AG specialize the design and manufacture of advanced Microwave
Plasma Processing systems for silicon and compound semiconductors. These
include:
- HB-LED
- Power devices
- MEMS
- PLED and
- Solar cell manufacturing
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Front-End Solutions for the Semiconductor Industry
PVA
TePla supply front-end solutions such as batch and single wafer systems for
photo resist ashing and descum, as well as removal of polymers, SU8 and
sacrificial layers for MEMS fabrication.
Back-End Solutions for the Semiconductor Industry
PVA
TePla's back-end/chip packaging applications include plasma cleaning and
surface activation prior to wire bond and encapsulation for Flip Chip, stacked
dies, MCM and advanced Cu lead frames.
Pre-Assembly Solutions for the Semiconductor Industry
PVA
TePla can slo supply pre-assembly solutions for stress relief, Chip Side
Healing (CSH) and passivation for ultra-thin wafer technologies with thicnesses
as low as 25µm. Their wafer metrology tools offer unique stress/defect analysis
(SIRD) and ion implantation monitoring (TWIN) for quality inspection on 300mm
wafers in high volume manufacturing environments.
About PVA Tepla
PVA
TePla is a world leading system engineering company. Their key technologies
centre around systems for hard-metal sintering and crystal growing as well as
the use of plasma systems for surface activation, functionalization, coating,
ultra-fine cleaning and etching.
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This information has been sourced, reviewed and
adapted from materials provided by PVA Tepla.
For more information on
this source, please visit PVA
Tepla.