Front-End Solutions for
the Semiconductor Industry
Back-End Solutions for the
Pre-Assembly Solutions for the
About PVA Tepla
AG specialize the design and manufacture of advanced Microwave
Plasma Processing systems for silicon and compound semiconductors. These
- Power devices
- PLED and
- Solar cell manufacturing
Front-End Solutions for the Semiconductor Industry
TePla supply front-end solutions such as batch and single wafer systems for
photo resist ashing and descum, as well as removal of polymers, SU8 and
sacrificial layers for MEMS fabrication.
Back-End Solutions for the Semiconductor Industry
TePla's back-end/chip packaging applications include plasma cleaning and
surface activation prior to wire bond and encapsulation for Flip Chip, stacked
dies, MCM and advanced Cu lead frames.
Pre-Assembly Solutions for the Semiconductor Industry
TePla can slo supply pre-assembly solutions for stress relief, Chip Side
Healing (CSH) and passivation for ultra-thin wafer technologies with thicnesses
as low as 25µm. Their wafer metrology tools offer unique stress/defect analysis
(SIRD) and ion implantation monitoring (TWIN) for quality inspection on 300mm
wafers in high volume manufacturing environments.
About PVA Tepla
TePla is a world leading system engineering company. Their key technologies
centre around systems for hard-metal sintering and crystal growing as well as
the use of plasma systems for surface activation, functionalization, coating,
ultra-fine cleaning and etching.
This information has been sourced, reviewed and
adapted from materials provided by PVA Tepla.
For more information on
this source, please visit PVA