Rapid Substrate Transfer in UHV Thin Film Deposition Processes

By AZoNano

Table of Contents

Introduction - Fast Entry Load lock
Key Features and Benefits
About VG Scienta

Introduction - Fast Entry Load lock

VG Scienta offers a suite of Fast Entry Load lock (FEL) modules for easy and rapid transfer of substrates from the vacuum system. During the process, the main vacuum chamber is not exposed to atmospheric contamination. Loading of samples and/or masks into the load lock chamber is performed through the quick-access door. A glove box option ensures the protection of ensures atmosphere sensitive substrates such as OLEDs.

It is possible to configure the units to form either a single deposition technology system by directly coupling with any of the OFT EDGE system deposition modules, or a cluster tool that can handle multiple deposition technologies when interfaced with the OFT EDGE sample handler. Moreover, it is possible to configure the FEL as a manually operated unit or with full turnkey functionality. The FEL can house glass, metal or flexible substrates with sizes as high as 100 x 100 mm. A string of pump and purge cycles through oil free vacuum pump combinations can accelerate pump down for large surface area or porous substrates. Moreover, it is possible to configure the FEL to provide an optional plasma cleaning step before transferring sample into the main vacuum chamber.

Fast Entry Load Lock Setup

Key Features and Benefits

The following are the key features and benefits of the FEL:

  • Transport samples up to 100 mm x 100 mm
  • Easy sample entry into vacuum system
  • Glove box compatible loading
  • Wide choice of fully customizable pre-configured load lock options
  • SoftShut low closure shock valve technology
  • Storage of up to 10 samples/masks
  • Fast pump down to working pressure with base pressure of 10-7 mbar (ultimate)

UV ozone treatment stages and plasma cleaning are the options available with the load lock. These options can optimize the work function of pre-deposited ITO and lower the surface carbon from ITO layers before the deposition of materials.

About VG Scienta

VG Scienta is the merger of the former Vacuum Generators and Gammadata Scienta businesses. By combining the expertise and knowledge from both companies VG Scienta is uniquely suited to meet the current and future needs of our customers.

Established in 1964, VG Scienta’s vacuum component business (formerly Vacuum Generators) built a name for itself based on high quality and technical innovation in UHV applications. VG Scienta continues to pioneer and innovate to go beyond the high standards demanded by the vacuum market. This has led to opportunities in semiconductor, surface science and synchrotron applications, maintaining the company’s position at the forefront of ultra high vacuum (UHV) technology.

This information has been sourced, reviewed and adapted from materials provided by VG Scienta.

For more information on this source, please visit VG Scienta.

Date Added: May 9, 2013 | Updated: Jun 11, 2013
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