The 3180 and 3190 are programmable wafer bonders offered by SST International
for high-reliability bonding of silicon, gallium-arsenide and glass wafers up
to 6 inches (150 mm) in diameter.
Both systems provide precise automatic control of heating and cooling at temperatures
up to 500 °C (1000°C optional). Bellows actuated clamping platens present
uniform mechanical bonding pressures up to 750 pounds (350 kg) to the wafer
pair. The 3190 also provides anodic (electrostatic) bonding capabilities with
a user-selected high-voltage power supply and chamber feed-through. Vacuum levels
down to 50 millitorr are provided in the 3180 by a two-stage mechanical pump.
Vacuum levels below 1 x 10-6 torr are provided in the 3190 by a cryogenic vacuum
pumping system combined with a dry mechanical forepump. Digital vacuum level
gauging is provided to monitor and control vacuum levels. Machine control is
provided by an embedded control system operating in a Microsoft Windows®
environment. An unlimited number of process profiles can easily be created and
stored in the controller. Run data is archived for quality control and off-line
data analysis. Internet and intranet network connectivity is available as an
option, permitting remote monitoring, troubleshooting and maintenance capabilities.
- Silicon to Glass Wafer Bonding
- MEMS Wafer Bonding
- Pressure Sensor Bonding
- Anodic Wafer Bonding