Semicore’s SC450 sputtering system is a reliable, high-performance, cost-effective tool. The company’s engineering talent and design initiatives contribute effectively to the capabilities, quality, and essential economy of the SC450. Semicore designs and manufactures precision thin film vacuum deposition systems and products.
Features
The key features of the advanced SC450 sputtering system are as follows:
- Fully automated, integrated controls
- Active deposition area up to 200 mm (8”) diameter
- Small volume, fast cycle processing
- Multiple sources (up to 4)
- Accommodates various substrates shape/sizes
- Confocal cathode arrangement
- Magnetron sources: 50 mm (2”), 75 mm (3”), or 100 mm (4”)
- Sequential or co-deposition modes
- Multiple process gas capability
- DC, Pulse DC, RF (HF or MF) power supplies
- Substrate; heating, cooling, RF/DC bias
- Integral cathode shutter
- In-situ cathode tilt
- Advanced FastCycle Load-lock also available
- R&D prototyping
Facilities Requirements
Process Gases
- Up to 3 different gases
- 138 - 207 kPa (20 - 30 psi.)
- ¼” VCR-4 connection type
- 99.999% purity semiconductor grade
Clean Dry Air
(Load lock or capacitance manometer option)
- 620 - 690 kPa (90 - 100 psi.)
- ¼” Swagelok® connection type
Nitrogen Vent
- 13 - 207 kPa (2 - 30 psi)
- ¼” Swagelok® connection type
- 99.999% purity semiconductor grade
Water
- ½” push fit connection type
- 13 - 27°C (55 - 80°F) water temperature
- 7.6 - 15 L/min (2.0 - 4.0 gpm)
- 207 kPa (30 psi.) delta min
- 552 kPa (80 psi.) max inlet pressure
- Distilled water or Propylene Glycol mix
- 900 W - 2 kW cooling capacity required
Electrical
- 208 - 240 VAC
- 20 - 40 Ω
- 50/60 Hz
- Single Phase