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Multi-Layer or Co-Deposition Physical Vapour Deposition Systems – Covap Series

Multi-Layer or Co-Deposition Physical Vapour Deposition Systems – Covap Series

The Covap series from Angstrom Engineering is a compact, economical and robust solution for use in several process applications. It is designed for the lab that requires a reliable and safe tool that produces repeatable, superior quality thin films in a compact footprint.

Covap is available with recipe storage, closed loop co-deposition control, and a unique rectangular clam-shell chamber for better accessibility (even when integrated with optional glovebox).

Deposition sources are isolated to minimize thermal effects and cross contamination. It is fitted with a complete set of removable chamber shielding to ensure that the chamber can be cleaned and maintained in an easy manner. When the chamber is open, source and stage power, as well as pneumatic pressure are cut, ensuring the highest level of safety.

Covap has a smart control interface, which enables new users to quickly become independent operators. The intelligently designed control allows multiple layers, and sequential or co-deposition, all with exceptional repeatability.

Substrate fixturing can support a maximum of 100 mm x 100 mm samples in a chamber that achieves high vacuum via a turbo-molecular pump, and can host either 2 or 4 thermal-resistive sources. All of this is possible in a compact 600 mm x 1000 mm system footprint. Covap may be compact, but it is a powerful tool.

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