Celsior™fxP is Aviza's advanced generation single wafer ALD system targeted
for 300-mm production at the 90-nm node and below. Celsior fxP offers expanded
revolutionary features to meet complex manufacturing requirements and the flexibility
and short cycle times for R&D.
Platform
Celsior fxP is capable of supporting up to 5 process modules for enhanced
throughput and productivity. The system is designed to be a 200-mm/300-mm bridge
offering the flexibility to process 200mm and/or 300mm wafers on the same platform.
Production-proven performance
A key feature of Celsior fxP is its efficiently designed and innovative chamber,
which offers increased throughput resulting in lower cost of ownership (CoO).
Other unique features include:
- Small reaction chamber utilizing computer modeled gas flow dynamics to
reduce the reaction volume and remove extraneous spaces-reducing the areas
available for defect formation resulting in higher die yields
- Patented showerhead design allows rapid, uniform gas delivery that is capable
of meeting less than 1 percent thickness uniformity requirements across a
300-mm wafer
- Reliable, field proven central transfer hub, which includes robust control
system-translating into higher system uptime and availability
- Extendibility and Flexibility by allowing near seamless process chamber
additions for adding future capacity or new material and process technology
Superior process results targeting 90 nm and below:
- Advanced DRAM Capacitor Dielectrics Al2O3/HfSiOx
- High-k Gate Dielectrics HfO2/HfSiOx/HfTiOx
- Flash Memory Dielectrics Al2O3/HfSiOx
- Low Temperature SiO2
- Low Temperature TiN
- Ruthenium