The L400 UHV magnetron sputtering system is designed for sequential sputtering
with movable magnetrons. Conventional sequential sputtering systems with rotating
planetary substrate stage provide limited substrate manipulation facilities.
In the L400 design the substrate stage is stationary and the magnetrons are
moved in sequence of the deposited multilayer. This allows the use of substrate
masking with movable shutters, RF and DC substrate bias, wedge deposition and
azimuthal substrate rotation - features not available in any other sputtering
The L400 deposition chamber has a differentially pumped main flange for quick
access to the magnetrons. The magnetron movement and indexing is fully computer
controlled allowing recipe based deposition of multilayer thin films.
The system can be used for sputtering of metals, insulators and magnetic materials
using either RF or DC sputtering. The maximum target size is 4" in diameter.