The FlexTRAK-WF Plasma System is designed for high-throughput processing of semiconductor wafers (and other flat substrates) in sizes ranging from 3 in. to 200mm (8 in.) in diameter, for wafers held in open cassettes.
Features and Benefits
Features and bemnefits of the FlexTRAK-WF Plasma System include:
- Dual cassette load stations to minimize idle time
- Multi-size capable aligner with minimal hardware change-over required
- Robust robotic wafer engine
- Integrated wafer recognition for high reliability wafer handling
- Compact design minimizes floor space
- Highly uniform treatment and fast throughput
The patented FlexTRAK plasma chamber design provides exceptional etch uniformity and process repeatability. Primary plasma applications include a variety of etching, ashing, and descum steps. Other plasma processes include contamination removal, surface roughening, increasing wettability, and enhancing bonding and adhesion strength.
Applications
Wafer processing prior to typical back-end packaging steps - suitable for wafer-level packaging, flip chip, or traditional packaging.
Wafer Cleaning
- Remove contamination prior to wafer bumping
- Remove organic contamination
- Remove Fluorine and other halogen contamination
- Remove metal and metal oxides
- Improve spun-on film adhesion
- Clean Aluminum bond pads
Wafer Etching
- Descum wafer of residual photoresist / BCB
- Pattern dielectric layers for redistribution
- Strip / Etch photoresist
- Enhance adhesion of wafer-applied materials
- Remove excess wafer-applied mold / epoxy
- Enhance adhesion of gold, solder bumps
- Destress wafer to reduce breakage
- Improve spun-on film adhesion
- Clean Aluminum bond pads