The Vistec SB250 electron beam lithography system is a cost-effective and universal tool for both the production of masks and direct write applications to enable customers to respond quickly to market demands. The system has a 210 x 210mm stage travel range making it a suitable tool for exposing masks up to 7inch and wafers up to 200mm in diameter.
The SB250 enables exposure and handling of non-transparent and transparent compound semiconductor materials. The modular system architecture enables the SB250 to be easily upgraded to a higher tool performance.
The completely automated substrate handling, the small clean room footprint and the sophisticated operating and data preparation software are convincing evidence of the SB250 Series being part of the modular toolset Vistec is offering to its customers from the industry and applied research sector.
Additional highlights of the new SB250 series are the field-proven Variable-shaped Beam (VSB), "Write-on-the-fly", Vector Scan writing modes and the 50keV shaped-beam column.
The key features of the SB250 Series optionally available to meet the specific requirements of its customers include:
A range of substrate sizes and types supported by fully-automated substrate handling including substrate pre-alignment.
Mark Detection Software Package (MDSP) including image field metrics.
Layout data preparation station covering up to 256 CPU cores for fracturing as well as additional Proximity Effect Correction (PROXECCO) and fogging correction options.
Graphical User Interface (GUI) compliant to SEMI E95.
Address grid down to 1nm.