Magnetron Sputtering System for Flat Substrates – Caroline D12B from ESTO-Vacuum

ESTO has designed Caroline D12B system for magnetron deposition on any flat substrates such as ceramic and silicon with the thickness of less than 30mm and diameter of less than 150mm. Maximum surface processing is 150x350mm.

Substrate holders are placed on a rotating drum. Up to four Magnetron units can be placed within the drum and sputter deposition is carried out in vertical direction. The magnetron units can sputter any type of material, including resistive alloys of chromium, copper, aluminum, nickel, etc.

Key Features

The main features of the Caroline D12B system are:

  • Preliminary cleaning of DC ion source surface for improved adhesion of the sputtered films
  • Preheating of substrates and sustaining the substrates temperature throughout film deposition
  • Control of metal and resistive films deposition process based on the resistance of the piece of the substrate and deposition time
  • Full sputtering automation from loading to unloading of substrates
  • Gas consumption control and gas flow rate stabilization in each channel
  • Vertical placement of substrates and targets on the drum
  • Easy-to-install substrates holders for fast loading and unloading operations
  • Rectangular vacuum chamber door allows for easy holders changing
  • Special hydraulic lift mechanism for easy maintenance of chamber equipment

Applications

The applications of the Caroline D12B system are:

  • Tantalum nitride films deposition
  • Resistive films deposition
  • Thick metal film deposition
  • Consequent PC and metal layers deposition
  • Tantalum and titanium films deposition and layers of corresponding oxides and nitrides
  • Silicon nitride and silicon dioxide films deposition using pure silicon target
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