Plasma-Enhanced Chemical Vapor Deposition System with Automated Airlock – Caroline PECVD15 from ESTO-Vacuum

Caroline PECVD15 system available from ESTO is designed for separate processing of flat substrates with a diameter of less than 200mm. The system includes a unique bench with the HF-bias applied for extracting and accelerating of plasma ions and also features a patented high density plasma generator with high frequency generator for plasma excitation.

The PECVD15 system can be fitted with heated or cooled bench based on client's requirements.

Key Features

The main features of the Caroline PECVD15 system are:

  • Multi-channel gas feed path
  • Automatic matching unit
  • Barotron (for vacuum monitoring in the working point)
  • Bench heating up to 300°C
  • Chemically resistant turbomolecular pump
  • Optional laser thickness gauge for the etching layer monitoring
  • Gas consumption control in each channel and four-channel gas flow rate stabilization
  • Full etching process automation from loading to unloading of substrates


The applications of the Caroline PECVD15 system are:

  • Ion assisted thin films deposition on dielectric substrate
  • Deposition of different types of films in the same processing cycle
  • Dielectric deposition from monosilane
  • Metal films deposition by cathode sputtering in inert gas plasma
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