FEI V600CE Focused Ion Beam (FIB) System

The V600 Family comprises the most efficient, flexible, and cost-effective circuit edit tools available for semiconductor labs. They enable fast, versatile modification and analysis with a single-column, focused ion beam (FIB) that effectively delivers high throughput circuit modification, cross-sectioning, and failure analysis. The V600 Family includes hardware and software extensions to address advanced circuit edit requirements below 65 nm, delivering the most cost-effective solutions for immediate and future requirements.

Advantages and Capabilities

Featuring FEI's most advanced 30 kV, 5 nm Sidewinder ion column, each member of the V600 Family is supremely capable of high-resolution imaging, milling, and quick access to subsurface features on a broad range of materials. Mid-column steering for low-voltage operations minimizes damage in TEM-sample lamellas while high-current operation ensures rapid material removal and increased sample throughput.

The new V600CE features the NanoChemix gas delivery system to deliver more advanced edit capability. It is the most versatile gas delivery system on the market, enabling the FIB operator to apply variable pressures of a wide variety of gases for unrivaled process control and optimization. The ability to blend gases through dual, opposing nozzles provides superior quality dielectric deposition material for insulating critical regions of an edit. The dual nozzle based delivery is also invaluable for maintaining floor uniformity or planarity while accessing lower metal layers of a device. The FEI NanoChemix gas delivery system supports delivery of these five gases for more advanced edit capability:

  • XeF2 - Etch for Dielectric (SiO2) and low-k
  • H2O (O2) - Etch for organics and copper cutting
  • Cl2 - Etch for aluminum and silicon
  • TMCTS - Insulator Deposition (SiO2) with O2
  • Tungsten Hexacarbonyl - Tungsten Deposition

The V600CE includes advanced software that improves circuit editing precision and end-pointing control to increase circuit edit success rates.

Extend the capabilities of the V600CE with the IR microscope and Bulk Si trenching package. A near infrared microscope permits imaging of target structures through front side dielectric and backside bulk silicon for fast, accurate navigation. The bulk silicon trenching hardware includes a special coaxial gas delivery nozzle that accelerates bulk silicon etching for faster access to circuitry from the backside.


V600CE is excellent performer for the following applications:

    • Circuit Edit
    • Failure Analysis
    • Defect Analysis
    • 3D Metrology
    • Materials and Sample Preparation
    • Nanoprototyping
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