Omniprobe Liftout Grids for Transmission Electron Microscopy (TEM) from Agar Scientif

Agar Scientific offers a range of Omniprobe lift-out grids that are particularly designed to accept TEM lamellae milled by SEM/FIB or FIB systems. The grids measure 25 to 30µm in thickness, with posts designed to ensure consistent attachment of lamellae while providing an uninterrupted view of each section. All grids measure 3mm in diameter.

Beryllium half-ring lift-out grids offer low etching rates for FIB, tripod polishing, ion milling applications. 3 post lift-out grids are designed for in situ lift-out, and comprise multiple indexed mounting locations, with V-shaped and vertical bar attachment surfaces. They are available in molybdenum or copper versions.

4 post lift-out grids include multiple indexed mounting locations, with two with V-shaped alignment surfaces and two vertical bar attachment surfaces. They have lower profile sides for easier access to the outermost posts. The grids are available in molybdenum or copper versions.

5 post copper lift-out grids contain multiple indexed mounting locations, with all vertical bar attachment surfaces. The sides have lower profile to allow easy access to the outermost posts. The grids are available in molybdenum or copper versions.

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