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SUSS MicroTec Qualifies DSC300 Gen2 Projection Lithography System for Volume Production

SUSS MicroTec Qualifies DSC300 Gen2 Projection Lithography System for Volume Production

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully qualified its new DSC300 Gen2 projection lithography system for volume production at a major Asian packaging house (OSAT). [More]
Molecular Self-Assemblies Can be Aligned from Nanometers to Millimeters Without External Stimuli Intervention

Molecular Self-Assemblies Can be Aligned from Nanometers to Millimeters Without External Stimuli Intervention

To ensure the survival of Moore's law and the success of the nanoelectronics industry, alternative patterning techniques that offer advantages beyond conventional top-down patterning are aggressively being explored. [More]
D2S Acquires Developer of GPGPU-Based Computational Lithography Acceleration Technology

D2S Acquires Developer of GPGPU-Based Computational Lithography Acceleration Technology

D2S®, a supplier of computational design platforms based on eBeam and general purpose graphic processing unit (GPGPU) technologies, today announced that it has acquired all assets of Gauda, Inc., a developer of GPGPU-based computational lithography acceleration technology headquartered in Sunnyvale, Calif. [More]
KLA-Tencor Introduces EUV-compatible Teron SL650 Reticle Inspection System for IC Fabs

KLA-Tencor Introduces EUV-compatible Teron SL650 Reticle Inspection System for IC Fabs

Today, KLA-Tencor Corporation announced the Teron™ SL650, a new reticle quality control solution for IC fabs that supports 20nm design nodes and beyond. [More]
Noel Technologies Now Offers Services for Nanoimprint Technology

Noel Technologies Now Offers Services for Nanoimprint Technology

Noel Technologies, a Silicon Valley specialty foundry offering process development and substrate fabrication, is now offering services for nanoimprint technology that reduce the costs of the nanoimprint stamps. [More]
nPoint Inc. Announce Release of Two New Piezo Stages

nPoint Inc. Announce Release of Two New Piezo Stages

With a position noise of 0.4nm in X and Y axis and 0.2nm in the Z, both stages provide the accuracy necessary for today’s advanced applications. When paired with the LC.400 series DSP controllers, the system provides closed-loop capability via capacitive sensors. [More]
Researchers Combine Silk Proteins with Photolithography

Researchers Combine Silk Proteins with Photolithography

When most people think of silk, the idea of a shimmering, silk scarf, or luxurious gown comes to mind. [More]
Global Semiconductor Dry Etching Equipment to Grow at 2.27% CAGR from 2013 to 2018

Global Semiconductor Dry Etching Equipment to Grow at 2.27% CAGR from 2013 to 2018

Research and Markets have announced the addition of the "Global Semiconductor Dry Etching Market 2014-2018" report to their offering. [More]
Research and Markets Adds Report on Global Atomic Layer Deposition Market 2014 - 2018

Research and Markets Adds Report on Global Atomic Layer Deposition Market 2014 - 2018

Research and Markets has announced the addition of the "Global Atomic Layer Deposition Market 2014-2018" report to their offering. [More]
New Mask Aligner MA200 Gen3 Tool for High Volume Manufacturing Launched by SÜSS MicroTec

New Mask Aligner MA200 Gen3 Tool for High Volume Manufacturing Launched by SÜSS MicroTec

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has launched the new Mask Aligner MA200 Gen3 today. The tool is designed for high volume manufacturing and can be used for exposing wafers with a diameter of up to 200 mm. [More]