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SEMICON West 2014: USHIO to Exhibit Lithography Tools for Advanced Packaging Applications

SEMICON West 2014: USHIO to Exhibit Lithography Tools for Advanced Packaging Applications

USHIO INC. (President and CEO: Shiro Sugata) today announced that at SEMICON West 2014 (Booth #2105) the company will exhibit a series of its lithography tools for advanced packaging applications, including the UX7-3Di LIS 350 stepper for 3D/2.5D silicon interposers, through a panel display as well as propose solutions for the challenges of next-generation packaging applications. SEMICON West 2014 is being held on July 8 through July 10 at Moscone Center in San Francisco, California. [More]
NSF Awards Grant for Study of Complex Physical and Chemical Reactions in Lithography Systems

NSF Awards Grant for Study of Complex Physical and Chemical Reactions in Lithography Systems

Have you ever wondered how the tiny components and devices inside your cell phone are made? [More]
EV Group Unveils GEMINI FB XT Fusion Wafer Bonding Platform

EV Group Unveils GEMINI FB XT Fusion Wafer Bonding Platform

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the GEMINI®FB XT—its next-generation fusion wafer bonding platform, which combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs). [More]
ZEISS Introduces Next Generation of Photomask Qualification System, AIMS 1x-193i

ZEISS Introduces Next Generation of Photomask Qualification System, AIMS 1x-193i

ZEISS introduces the next generation of photomask qualification system AIMS™ 1x-193i at this year´s European Mask and Lithography Conference (EMLC) in Dresden. ZEISS has experience in aerial imaging technology and AIMS™ for more than 20 years and has become a defacto-industry standard for printability analysis of mask defects. [More]
SUSS MicroTec Qualifies DSC300 Gen2 Projection Lithography System for Volume Production

SUSS MicroTec Qualifies DSC300 Gen2 Projection Lithography System for Volume Production

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully qualified its new DSC300 Gen2 projection lithography system for volume production at a major Asian packaging house (OSAT). [More]
Molecular Self-Assemblies Can be Aligned from Nanometers to Millimeters Without External Stimuli Intervention

Molecular Self-Assemblies Can be Aligned from Nanometers to Millimeters Without External Stimuli Intervention

To ensure the survival of Moore's law and the success of the nanoelectronics industry, alternative patterning techniques that offer advantages beyond conventional top-down patterning are aggressively being explored. [More]
D2S Acquires Developer of GPGPU-Based Computational Lithography Acceleration Technology

D2S Acquires Developer of GPGPU-Based Computational Lithography Acceleration Technology

D2S®, a supplier of computational design platforms based on eBeam and general purpose graphic processing unit (GPGPU) technologies, today announced that it has acquired all assets of Gauda, Inc., a developer of GPGPU-based computational lithography acceleration technology headquartered in Sunnyvale, Calif. [More]
KLA-Tencor Introduces EUV-compatible Teron SL650 Reticle Inspection System for IC Fabs

KLA-Tencor Introduces EUV-compatible Teron SL650 Reticle Inspection System for IC Fabs

Today, KLA-Tencor Corporation announced the Teron™ SL650, a new reticle quality control solution for IC fabs that supports 20nm design nodes and beyond. [More]
Noel Technologies Now Offers Services for Nanoimprint Technology

Noel Technologies Now Offers Services for Nanoimprint Technology

Noel Technologies, a Silicon Valley specialty foundry offering process development and substrate fabrication, is now offering services for nanoimprint technology that reduce the costs of the nanoimprint stamps. [More]
nPoint Inc. Announce Release of Two New Piezo Stages

nPoint Inc. Announce Release of Two New Piezo Stages

With a position noise of 0.4nm in X and Y axis and 0.2nm in the Z, both stages provide the accuracy necessary for today’s advanced applications. When paired with the LC.400 series DSP controllers, the system provides closed-loop capability via capacitive sensors. [More]