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Electron-Beam Lithography Systems Supplier, Vistec Electron Beam, Establishes Show Room Facility in Schaumburg, IL

Electron-Beam Lithography Systems Supplier, Vistec Electron Beam, Establishes Show Room Facility in Schaumburg, IL

Vistec Electron Beam GmbH, a leading supplier of electron-beam lithography systems, announced today, that it has established a show room facility in Schaumburg, IL to promote and demonstrate their Variable Shaped Beam systems specifically for the US and North America market. [More]
Heidelberg Instruments Introduces MLA Masskless Aligner Systems

Heidelberg Instruments Introduces MLA Masskless Aligner Systems

Heidelberg Instruments significantly extends its leadership in manufacturing of direct write lithography systems with the launch of MLA Maskless Aigner series of systems. Low to mid volume lithography traditionally consist of creating designs with a CAD software, followed by fabricating or purchasing a photomask and finally using a mask aligner or stepper to transfer the pattern on to the photoresist. For high volume manufacturing of sub-micron design nodes, this traditional process is required. [More]
Rudolph Technologies Receives Follow-On Order for Lithography and Inspection Systems

Rudolph Technologies Receives Follow-On Order for Lithography and Inspection Systems

Rudolph Technologies, Inc. announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep® Advanced Packaging Lithography System and multiple NSX® Inspection Systems for use in their planned capacity expansion. The tools, which will ship this quarter and next, will be used in high-performance fan-out wafer level packaging (FOWLP) applications. [More]
Applied Materials Introduces Centura Tetra Z Photomask Etch System for Quadruple Nanoscale Patterning

Applied Materials Introduces Centura Tetra Z Photomask Etch System for Quadruple Nanoscale Patterning

Applied Materials today announced the Applied Centura® Tetra(TM) Z Photomask Etch system for etching next-generation optical lithographic photomasks needed by the industry to continue multiple patterning scaling to the 10nm node and beyond. The new tool extends the capabilities of Applied's industry-leading Tetra platform, delivering angstrom-level photomask accuracy for critical dimension (CD) parameters required to meet stringent patterning specifications for future logic and memory devices. [More]
First-of-its-Kind 450mm Immersion Lithography Tool Installed at SUNY Poly's Albany NanoTech Campus

First-of-its-Kind 450mm Immersion Lithography Tool Installed at SUNY Poly's Albany NanoTech Campus

Governor Andrew M. Cuomo today announced the installation of the world’s first ever 450mm Immersion Scanner has begun at the SUNY Polytechnic Institute's Albany NanoTech Complex. Developed by Nikon Corporation, this first of its kind tool will accelerate the development of the next generation computer chips used in a variety of consumer and commercial applications. [More]
SEMICON Southeast Asia: Advantest to Highlight Nanotechnology Metrology and Lithography Tools

SEMICON Southeast Asia: Advantest to Highlight Nanotechnology Metrology and Lithography Tools

Experience the newest developments in semiconductor test solutions, nanotechnology products and terahertz systems by visiting leading semiconductor test equipment supplier Advantest Corporation's exhibit at SEMICON Southeast Asia. The exposition takes place April 22-24, 2015, at the SPICE Arena in Penang, Malaysia. [More]
Researchers Produce Nanowires Using Meniscus-Mask Lithography

Researchers Produce Nanowires Using Meniscus-Mask Lithography

Water is the key component in a Rice University process to reliably create patterns of metallic and semiconducting wires less than 10 nanometers wide. [More]
Major OSAT Manufacturer Selects Rudolph JetStep® Advanced Packaging Lithography System for Evaluation

Major OSAT Manufacturer Selects Rudolph JetStep® Advanced Packaging Lithography System for Evaluation

Rudolph Technologies, Inc. announced today that a major outsourced assembly and test (OSAT) manufacturer has selected the JetStep® Advanced Packaging Lithography System for evaluation. The tool, which ships this week, will be used to develop copper (Cu) pillar bumping and through silicon via (TSV) processes used in the development of next-generation flip chip technology. [More]
Confining Charge Transport and Recombination to Nanoscale Areas Increases Efficiency of OLEDs

Confining Charge Transport and Recombination to Nanoscale Areas Increases Efficiency of OLEDs

Organic light emitting diodes (OLEDs), which are made from carbon-containing materials, have the potential to revolutionize future display technologies, making low-power displays so thin they'll wrap or fold around other structures, for instance. [More]
SUSS MicroTec Receives Large Lithography Tools Order from TDK

SUSS MicroTec Receives Large Lithography Tools Order from TDK

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, has received a large order for various lithography tools from TDK in Q4 2014. Delivery and installation will take place already in the first quarter 2015. [More]