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Applied Materials Announces Collaboration to Develop Advanced Patterning Solution for Memory Devices

Applied Materials Announces Collaboration to Develop Advanced Patterning Solution for Memory Devices

Applied Materials, Inc. today announced it collaborated with Samsung Electronics Co., Ltd. and PSK Inc., a Korea-based leader in photoresist removal, to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs. [More]
Researcher’s Nanoscale Work Shows Promise to Transform Energy Production, Storage, and Lighting

Researcher’s Nanoscale Work Shows Promise to Transform Energy Production, Storage, and Lighting

An avid amateur astronomer during her childhood in Vukovar, Croatia, Silvija Gradeèak, associate professor in materials science and engineering, was not content observing the physical world only from a distance: “I discovered what I really liked about science were experiments, and having the ability to make something with my hands,” she says. [More]
INVECAS to Operate SoC Design Service Centers to Provide Support for GLOBALFOUNDRIES Customers

INVECAS to Operate SoC Design Service Centers to Provide Support for GLOBALFOUNDRIES Customers

GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing, design and technology solutions, today announced a partnership with INVECAS Inc., a newly formed design services provider focused on accelerating customer introduction of new products on leading-edge semiconductor process technologies. [More]
ANL Places $1.3 Million Order with CVD for UHV Deposition System

ANL Places $1.3 Million Order with CVD for UHV Deposition System

CVD Equipment Corporation, a leading provider of standard and custom chemical vapor deposition systems, today announced that it has received a $1.3 Million order from Argonne National Laboratory (ANL) to manufacture an ultrahigh vacuum (UHV) deposition system for the growth of multilayer Laue lenses used for nanoscale imaging. [More]
ProPlus Design Solutions Releases Re-Innovated BSIMProPlus SPICE Modeling Platform for Nanometer Devices

ProPlus Design Solutions Releases Re-Innovated BSIMProPlus SPICE Modeling Platform for Nanometer Devices

ProPlus Design Solutions Inc., the SPICE modeling solutions leader and provider of the first giga-scale SPICE simulator and unique Design-for-Yield (DFY) solutions, today introduced the latest release (2014.2) of the re-innovated BSIMProPlus™, the leading SPICE modeling platform for nanometer devices. [More]
Tango Systems Publishes Results for Conformal Step Seed Layer Coverage for TSVs with 15:1 Aspect Ratio

Tango Systems Publishes Results for Conformal Step Seed Layer Coverage for TSVs with 15:1 Aspect Ratio

Tango Systems Inc., a leading innovator in high-performance, cost-effective physical vapor deposition (PVD) systems, today announced it has published results for conformal step seed layer coverage for through silicon vias (TSVs) with a15:1 aspect ratio. This significant achievement represents the industry's highest TSV step coverage for interposers and 3D ICs. The results were achieved using Tango's flagship Axcela™ PVD platform. [More]
STMicroelectronics Starts Production of MEMS Sensors using THELMA60 Surface-Micromachining Fabrication Process

STMicroelectronics Starts Production of MEMS Sensors using THELMA60 Surface-Micromachining Fabrication Process

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, the world's top MEMS (Micro-Electro-Mechanical Systems) manufacturer and the leading supplier of MEMS for consumer and mobile1 as well as automotive applications2, today announced that it had started production of MEMS sensors using its newly qualified, proprietary THELMA60 (60µm Thick Epi-poly Layer for Micro-gyroscopes and Accelerometers) surface-micromachining fabrication process. [More]
Texas Instruments to Expand Manufacturing Capacity in Chengdu with 300mm Wafer Bumping Facility

Texas Instruments to Expand Manufacturing Capacity in Chengdu with 300mm Wafer Bumping Facility

Texas Instruments Incorporated (TI) today announced it will expand its manufacturing capacity in Chengdu, China, with a 300mm wafer bumping facility. The addition of this manufacturing process in Chengdu further increases TI's 300mm analog capacity and its ability to support customer demand. [More]
Xilinx Introduces 20nm DSP-Optimized Kintex UltraScale KU115 FPGA

Xilinx Introduces 20nm DSP-Optimized Kintex UltraScale KU115 FPGA

Xilinx, Inc. today announced the expansion of its 20 nm portfolio with shipment of the Kintex® UltraScale™ KU115 FPGA. As the flagship of the Kintex UltraScale family, the KU115 offers the highest DSP count available in a single programmable device, doubling the DSP resources previously available. This DSP-optimized KU115 FPGA targets data center compute acceleration and signal processing applications including data center, video and medical imaging, broadcast systems, and radar. [More]
Molecular Imprints Demonstrates Low Cost Nanopatterning Fabrication Process for High Performance Touch Sensors

Molecular Imprints Demonstrates Low Cost Nanopatterning Fabrication Process for High Performance Touch Sensors

Molecular Imprints Inc. (MII), the market and technology leader for nanopatterning solutions, today announced it has demonstrated a low cost fabrication process for high performance touch sensors for the display market using an innovative metal mesh structure. [More]