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Growing Demand for Miniaturized Components Drives Global Atomic Layer Deposition Market

Growing Demand for Miniaturized Components Drives Global Atomic Layer Deposition Market

Research and Markets has announced the addition of the "Global Atomic Layer Deposition Market 2014-2018: Market to Grow at a CAGR of 36% with Adeka, Applied materials & ASM Int Dominating" report to their offering. [More]
Novel Scalable Method for Producing One-Atom-Thick Layers of Molybdenum Diselenide

Novel Scalable Method for Producing One-Atom-Thick Layers of Molybdenum Diselenide

Nanoengineering researchers at Rice University and Nanyang Technological University in Singapore have unveiled a potentially scalable method for making one-atom-thick layers of molybdenum diselenide — a highly sought semiconductor that is similar to graphene but has better properties for making certain electronic devices like switchable transistors and light-emitting diodes. [More]
New Report on Global Semiconductor Dry Etching Market

New Report on Global Semiconductor Dry Etching Market

Research and Markets has announced the addition of the "Global Semiconductor Dry Etching Market 2014-2018 with APPLIED Materials, Hitachi High-Technology, Lam Research, Tokyo Electron Dominating" report to their offering. [More]
Gold Coating Over Etched Nanoscale Pattern Dims Glare

Gold Coating Over Etched Nanoscale Pattern Dims Glare

All that's gold does not glitter, thanks to new work by UC Irvine scientists that could reduce glare from solar panels and electronic displays and dull dangerous glints on military weapons. [More]
DNP Photomask Technology Taiwan Merges into Photronics Semiconductor Mask Corporation

DNP Photomask Technology Taiwan Merges into Photronics Semiconductor Mask Corporation

Photronics, Inc., a worldwide leader in supplying innovative imaging technology solutions for the global electronics industry, today announced the successful closing of the previously announced joint venture with Dai Nippon Printing Co., Ltd. (DNP) (7912:Tokyo Stock Exchange). [More]
New Mask Aligner MA200 Gen3 Tool for High Volume Manufacturing Launched by SÜSS MicroTec

New Mask Aligner MA200 Gen3 Tool for High Volume Manufacturing Launched by SÜSS MicroTec

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has launched the new Mask Aligner MA200 Gen3 today. The tool is designed for high volume manufacturing and can be used for exposing wafers with a diameter of up to 200 mm. [More]
University of Washington in Seattle to Install Altatech’s Chemical Vapor Deposition System

University of Washington in Seattle to Install Altatech’s Chemical Vapor Deposition System

Altatech, a subsidiary of Soitec, has received an order from the University of Washington in Seattle for an AltaCVD(TM) chemical vapor deposition (CVD) system whose unique combination of capabilities allows users to develop new process materials with high added value. [More]
Environmentally Friendly Method to Generate Nanostructures from Silk

Environmentally Friendly Method to Generate Nanostructures from Silk

Tufts University engineers have demonstrated that it is possible to generate nanostructures from silk in an environmentally friendly process that uses water as a developing agent and standard fabrication techniques. [More]
Liquid Repellent Nano-Coating Technology Provider, P2i, Opens Technology Center in Shenzhen

Liquid Repellent Nano-Coating Technology Provider, P2i, Opens Technology Center in Shenzhen

P2i, the world leader in liquid repellent nano-coating technology, today opened a new technology center in Shenzhen, China, following increased demand for its protective coatings on consumer electronics such as smartphones, tablets and wearable devices. [More]
Patterning Material System of Hard-Nano-Film/Soft-Matter-Substrates Helps Control Surface Buckling Wrinkles

Patterning Material System of Hard-Nano-Film/Soft-Matter-Substrates Helps Control Surface Buckling Wrinkles

Wrinkling is a common phenomenon for thin stiff film adhered on soft substrate. Various wrinkling phenomenon has been reported previously. Wu Dan, Yin Yajun, Xie Huimin,et al from Tsinghua University proposed a new method to control wrinkling and buckling of thin stiff film on soft substrate. It is found that the curve pattern on the soft substrate has obvious influence on the wrinkling distribution of the thin film/soft substrate. [More]
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