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TSMC Honors Cadence with Partner of the Year Awards for Soft IP and 16nm FinFET Plus Solutions

TSMC Honors Cadence with Partner of the Year Awards for Soft IP and 16nm FinFET Plus Solutions

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that it has won two TSMC Partner of the Year awards during the TSMC Open Innovation Platform® (OIP) Ecosystem Forum. Cadence was presented with awards for both Soft IP and joint development of 16nm FinFET Plus (16FF+) design infrastructure. [More]
Synopsys Honored with TSMC Partner of the Year Award for Interface IP and Joint Development of 16-nm FinFET Plus Design Infrastructure

Synopsys Honored with TSMC Partner of the Year Award for Interface IP and Joint Development of 16-nm FinFET Plus Design Infrastructure

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that TSMC is recognizing Synopsys with their "2014 Partner of the Year" award in the areas of: Interface IP and Joint Development of 16-nm FinFET Plus Design Infrastructure. [More]
New Automated High-Vacuum Wafer Bonding System from EV Group

New Automated High-Vacuum Wafer Bonding System from EV Group

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®580 ComBond®¯a high-vacuum wafer bonding system, which enables electrically conductive and oxide-free covalent bonds at room temperature. [More]
New Method to Create Surfaces on Which Droplets of Desired Shapes Can Form Spontaneously

New Method to Create Surfaces on Which Droplets of Desired Shapes Can Form Spontaneously

MIT researchers have developed a new way of creating surfaces on which droplets of any desired shape can spontaneously form. They say this approach could lead to new biomedical assay devices and LED display screens, among other applications. [More]
CEATEC Japan: ITRI and Komori Report Results from One-Step Roll-to-Roll Metal Mesh Printing Technology

CEATEC Japan: ITRI and Komori Report Results from One-Step Roll-to-Roll Metal Mesh Printing Technology

ITRI and Komori disclose the collaboration results in one-step roll-to-roll metal mesh printing technology at 2014 CEATEC Japan from October 7th to 11th. The two parties will demonstrate a one-step printing technology for 11.6" touch panels with 5µm metal mesh and 30µm frame wires as well as 3µm printing capabilities. [More]
ARMv8-A Processor IP to be Optimized for TSMC 10FinFET Process Technology

ARMv8-A Processor IP to be Optimized for TSMC 10FinFET Process Technology

ARM® and TSMC today announced a new multi-year agreement that will deliver ARMv8-A processor IP optimized for TSMC 10FinFET process technology. Because of the success in scaling from 20SoC to 16FinFET, ARM and TSMC have decided to collaborate again for 10FinFET. This early pathfinding work will provide valuable learning to enable physical design IP and methodologies in support of customers to tape-out 10FinFET designs as early as Q4 2015. [More]
NSF Awards Grants to Investigate 2-D Layered Materials Beyond Graphene

NSF Awards Grants to Investigate 2-D Layered Materials Beyond Graphene

Graphene, a form of carbon in which a single layer of atoms forms a two-dimensional, honeycomb crystal lattice, conducts electricity and heat efficiently and interacts with light in unusual ways. These properties have led to worldwide efforts in exploring its use in electronics, photonics and many other applications. [More]
New Ultra-Low Power Technology Platform for IoT and Wearable Device Applications from TSMC

New Ultra-Low Power Technology Platform for IoT and Wearable Device Applications from TSMC

TSMC today announced the foundry segment's first and most comprehensive ultra-low power technology platform aimed at a wide range of applications for the rapidly evolving Internet of Things (IoT) and wearable device markets that require a wide spectrum of technologies to best serve these diverse applications. [More]
ATopTech Optimizes Physical Implementation Tools to Support TSMC 16nm FinFET Plus Designs

ATopTech Optimizes Physical Implementation Tools to Support TSMC 16nm FinFET Plus Designs

ATopTech, a leader in next generation physical design solutions, continued their ongoing collaboration with TSMC by further optimizing ATopTech physical implementation tools to support advanced designs in TSMC 16nm FinFET Plus (16FF+) V0.9 Design Rule Manual and SPICE model. [More]
ANSYS’ RedHawk and Totem Products Receive Certification for TSMC 16-nm FinFET+Technology

ANSYS’ RedHawk and Totem Products Receive Certification for TSMC 16-nm FinFET+Technology

ANSYS announced today that its RedHawk™ and Totem™ products are certified for TSMC 16-nanometer (nm) FinFET+ (N16FF+), a second-generation FinFET technology delivering power, performance and area advantages over the previous generation. [More]