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Researchers Fabricate Electrically Conductive Nanocomposite Laminate with Less Graphene Loading

Researchers Fabricate Electrically Conductive Nanocomposite Laminate with Less Graphene Loading

Researchers at the Department of Energy’s Oak Ridge National Laboratory (ORNL) have developed a new method for commercial-scale fabrication of graphene. This could lead to significant advances in flexible electronics, and could possibly change the manner in which graphene is viewed and utilized. [More]
ARM and UMC Offer Artisan Physical IP Solution on 55nm

ARM and UMC Offer Artisan Physical IP Solution on 55nm

ARM and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced the availability of a new ARM® Artisan® physical IP solution on 55nm to accelerate the development of ARM processor-based embedded systems and Internet of Things (IoT) applications. [More]
BESSTECH Receives $250,000 ENYA Investment to Accelerate Commercialization of Lithium-Ion Battery Technology

BESSTECH Receives $250,000 ENYA Investment to Accelerate Commercialization of Lithium-Ion Battery Technology

BESSTECH Announces $250K Investment from Eastern New York Angels Funding will accelerate commercialization of BESSTECH’s innovative lithium-ion battery electrode technology and enable hiring of key personnel. [More]
U.S DOE Awards Dais Analytic$1.2 Million Additional Funding to Commercialize NanoAir Membrane HVAC Technology

U.S DOE Awards Dais Analytic$1.2 Million Additional Funding to Commercialize NanoAir Membrane HVAC Technology

Dais Analytic Corporation, a commercial nanotechnology materials business selling its industry-changing technology into the worldwide energy and water markets, today announced it has been selected to receive additional funding of $1.2 million from the U.S Department of Energy (DOE) to further commercialize its Heating, Ventilation, and Air-Conditioning (HVAC) membrane technology for its NanoAir™ product. [More]
Cadence Achieves USB-IF Certification for USB 3.0 Host IP Solution on TSMC 16nm FinFET Plus Process

Cadence Achieves USB-IF Certification for USB 3.0 Host IP Solution on TSMC 16nm FinFET Plus Process

Cadence Design Systems, Inc. today announced that its USB 3.0 host IP solution for TSMC’s 16nm FinFET Plus (16FF+) process is one of the first to pass USB-IF compliance testing and receive USB-IF certification. [More]
ANSYS RedHawk and Totem Receive UMC Certification for 28 and 40-nm Technologies

ANSYS RedHawk and Totem Receive UMC Certification for 28 and 40-nm Technologies

ANSYS simulation tools, which deliver needed accuracy and reduced turnaround time, while ensuring power integrity and electromigration (EM) reliability, have been certified by UMC 28 and 40-nanometer (nm) technologies. [More]
Researchers Study Nanoscale Drug Vesicles to Determine Precise Dynamics of Crystallization

Researchers Study Nanoscale Drug Vesicles to Determine Precise Dynamics of Crystallization

Water, when cooled below 32°F, eventually freezes — it's science known even to pre-schoolers. But some substances, when they undergo a process called "rapid-freezing" or "supercooling," remain in liquid form — even at below-freezing temperatures. [More]
Chemists Utilize Ultrasonic Spray Pyrolysis to Make Tiny Silicone Microspheres

Chemists Utilize Ultrasonic Spray Pyrolysis to Make Tiny Silicone Microspheres

Technology in common household humidifiers could enable the next wave of high-tech medical imaging and targeted medicine, thanks to a new method for making tiny silicone microspheres developed by chemists at the University of Illinois. [More]
Global Strategic Business Report on Nanoencapsulation for Food Products

Global Strategic Business Report on Nanoencapsulation for Food Products

Research and Markets has announced the addition of the "Nanoencapsulation for Food Products - Global Strategic Business Report" report to their offering. [More]
Credo Delivers Silicon-Proven 28G NRZ SerDes IP on TSMC 16nm FinFET Plus Process

Credo Delivers Silicon-Proven 28G NRZ SerDes IP on TSMC 16nm FinFET Plus Process

Credo Semiconductor, a global innovation leader in Serializer-Deserializer (SerDes) technology, today announced it is the first company to deliver silicon-proven 28G NRZ SerDes IP on the TSMC 16-nanometer FinFET Plus (16FF+) process, and will demonstrate its high-performance, low power characteristics at the TSMC Symposium this week in Shanghai, China. [More]
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