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World’s Largest DNA Origami Created

World’s Largest DNA Origami Created

Researchers from North Carolina State University, Duke University and the University of Copenhagen have created the world’s largest DNA origami, which are nanoscale constructions with applications ranging from biomedical research to nanoelectronics. [More]
SMIC Launches 38nm NAND Process Technology

SMIC Launches 38nm NAND Process Technology

Semiconductor Manufacturing International Corporation ("SMIC";) announced the readiness of 38nm NAND Flash process technology, making it the only foundry to manufacture NAND products for its customers. [More]
Researchers Present Paper on Resistless Nanofabrication by Stencil Lithography

Researchers Present Paper on Resistless Nanofabrication by Stencil Lithography

Congratulations to Oscar Vazquez-Mena, Shenqi Xie and Guillermo Villanueva who co-authored a review paper about stencil lithography "Resistless nanofabrication by stencil lithography: A review" recently published on Microelectronic Engineering. [More]
Research on Synthesis, Self-Assembly of Gold Nanorods Wins NSF Special Creativity Award

Research on Synthesis, Self-Assembly of Gold Nanorods Wins NSF Special Creativity Award

Ounce for ounce, gold nanorods that are commercially available cost about 7,000 times more than bulk gold, but that may change, thanks to an award-winning research program in the laboratory of Rice University chemist Eugene Zubarev. [More]
Researchers Engineer Nanoscale Versions of Key Mass Spectrometry Components

Researchers Engineer Nanoscale Versions of Key Mass Spectrometry Components

Electrospray arrays can dramatically downsize systems and costs for onsite chemical analysis — and many other applications. [More]
Toshiba and SanDisk Begin Production in Second Phase of Fab 5 with 15nm NAND Flash Memory Process Technology

Toshiba and SanDisk Begin Production in Second Phase of Fab 5 with 15nm NAND Flash Memory Process Technology

Toshiba Corporation and SanDisk Corporation today celebrated the opening of the second phase of the No. 5 semiconductor fabrication facility (Fab 5) and the start of construction of the new No. 2 fabrication facility (Fab 2) at Yokkaichi Operations, Toshiba’s NAND Flash memory plant in Mie prefecture, Japan. [More]

QuickLogic ArcticLink 3 S2 Ultra-Low Power Sensor Hub Leverages GLOBALFOUNDRIES’ 65nm Process Technology

QuickLogic Corporation, the innovator of ultra-low power programmable Customer Specific Standard Products (CSSPs), and GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announc... [More]
Working OTP Bit Cells Demonstrated by Sidense in TSMC 16nm FinFET Technology

Working OTP Bit Cells Demonstrated by Sidense in TSMC 16nm FinFET Technology

Sidense Corp., a leading developer of non-volatile memory OTP IP cores, today announced that it successfully demonstrated read and write capability for its 1T-OTP bit-cell architecture on test silicon fabricated in a 16nm CMOS FinFET process. [More]
Veeco Launches TurboDisc EPIK700 GaN Metal Organic Chemical Vapor Deposition system

Veeco Launches TurboDisc EPIK700 GaN Metal Organic Chemical Vapor Deposition system

Veeco Instruments Inc. introduced today the new TurboDisc® EPIK700™ Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) system that combines the industry’s highest productivity and best-in-class yields with low cost of operation, further enabling lower manufacturing costs for light emitting diodes (LEDs) for general lighting applications. [More]
ProPlus' BSIMProPlus Modeling Platform Deployed for Samsung Electronics’ 14-nm FinFET SPICE Modeling

ProPlus' BSIMProPlus Modeling Platform Deployed for Samsung Electronics’ 14-nm FinFET SPICE Modeling

ProPlus Design Solutions, Inc. today announced Samsung Electronics has extended its long-term partnership with ProPlus through the deployment of ProPlus' BSIMProPlus modeling platform for its 14-nanometer (nm) FinFET SPICE modeling. [More]