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Credo and GUC Partner to Integrate 28G and 56G IP with 16nmFF+ SOC Platform

Credo and GUC Partner to Integrate 28G and 56G IP with 16nmFF+ SOC Platform

Global Unichip Corp. (GUC), the Flexible ASIC Leader™, and Credo Semiconductor, a global innovation leader in Serializer-Deserializer (SerDes) technology, today announced they are collaborating to enable the development of high-performance networking solutions that will be manufactured using TSMC's 16-nm FinFET+ process technology. [More]
Cimav Conducts Research on Nanostructured Materials with Biocompatible, Antibacterial Properties

Cimav Conducts Research on Nanostructured Materials with Biocompatible, Antibacterial Properties

One of the goals of Cimav specialists is to develop biomedical implants needed in Mexico, as the ones existing in the domestic market are usually manufactured abroad. [More]
Shanghai Huali Microelectronics Corporation Presents Outlook for IoT Market at ICCAD 2014

Shanghai Huali Microelectronics Corporation Presents Outlook for IoT Market at ICCAD 2014

Chinese IC manufacturer Shanghai Huali Microelectronics Corporation gave a presentation on its outlook for the Internet of Things (IoT) market and the wide application of its specialty technology at the 2014 China Semiconductor Industry Association IC Design Branch Annual Conference, which was recently held at Hong Kong Science Park. [More]
Nano-Cellulose Filters for Removal of Environmentally Hazardous Contaminants from Industrial Effluents

Nano-Cellulose Filters for Removal of Environmentally Hazardous Contaminants from Industrial Effluents

Prototypes of nano-cellulose based filters with high purification capacity towards environmentally hazardous contaminants from industrial effluents eg. process industries, have been developed by researchers at Luleå University of Technology. The research, conducted in collaboration with Imperial College in the UK has reached a breakthrough with the prototypes and they will now be tested on a few industries in Europe. [More]
Bristol Awarded £450,000 to Develop GaN Nano-Engineered Semiconductors

Bristol Awarded £450,000 to Develop GaN Nano-Engineered Semiconductors

The Universities of Bath, Bristol, Sheffield and Strathclyde and their industrial partners have been given funding to develop the UK into a future hub for the manufacture of advanced semiconductor materials. [More]
Nanothin Semiconductor Layer Provides Ultrathin Coatings in Vivid Colors

Nanothin Semiconductor Layer Provides Ultrathin Coatings in Vivid Colors

In a sub-basement deep below the Laboratory for Integrated Science and Engineering at Harvard University, Mikhail Kats gets dressed. Mesh shoe covers, a face mask, a hair net, a pale gray jumpsuit, knee-high fabric boots, vinyl gloves, safety goggles, and a hood with clasps at the collar--these are not to protect him, Kats explains, but to protect the delicate equipment and materials inside the cleanroom. [More]
Samsung Commences Mass Production of 20nm 8Gb LPDDR4 Mobile DRAM

Samsung Commences Mass Production of 20nm 8Gb LPDDR4 Mobile DRAM

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has started mass producing the industry’s first 8 gigabit (Gb), low power double data rate 4 (LPDDR4) mobile DRAM based on the company’s leading-edge 20-nanometer (nm) process technology. LPDDR memories are the most widely used “working memory” for mobile devices worldwide. [More]
Renesas Electronics Develops New Circuit Technology for Automotive Information SoCs at 16nm

Renesas Electronics Develops New Circuit Technology for Automotive Information SoCs at 16nm

Renesas Electronics Corporation, a premier provider of advanced semiconductor solutions, today announced the development of a new circuit technology for automotive information SoCs (system on chips) at 16 nanometer (nm) and beyond. [More]
Quad-Core Silicon Built Around ARM Cortex-A17 Processor Implemented Using GLOBALFOUNDRIES’ 28nm-SLP Process Delivered

Quad-Core Silicon Built Around ARM Cortex-A17 Processor Implemented Using GLOBALFOUNDRIES’ 28nm-SLP Process Delivered

Cadence Design Systems, Inc., a leader in global electronic design innovation, and GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced the delivery of quad-core silicon built around the ARM® Cortex®-A17 processor implemented using GLOBALFOUNDRIES’ 28nm Super Low Power (28nm-SLP) process with High-k Metal Gate (HKMG) technology. [More]
Atomic Force Microscopy Etches Nanoscale Patterns on Conductive Polymers

Atomic Force Microscopy Etches Nanoscale Patterns on Conductive Polymers

Researchers at Oak Ridge National Laboratory (ORNL) have successfully carved out nanoscale designs on polymer surfaces using atomic force microscopy (AFM). [More]
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