Picosun Oy, leading Atomic Layer Deposition (ALD) equipment manufacturer, reports excellent process results for copper diffusion barrier deposition. ALD materials for copper diffusion barriers were investigated in the project ESiP (Efficient Silicon Multi-Chip System-in-Package Integration – Reliability, Failure Analysis and Test), running from May 2010 to June 2013.
[More]
Texas Instruments Incorporated (TI) today outlined its long-term strategy for manufacturing facilities in Chengdu, China. Future plans include a new assembly/test operation and the expansion of its existing wafer fabrication factory.
[More]
In the not-so-distant future, patients with heart disease won’t have to strap brick-size Holter monitors to their arms or waists, with webs of electrodes connected to their chests to monitor their hearts. Those unable to speak will communicate by muscle movements in their throats, and the blind will read with finger tubes that “poke” their fingertips with programmable electrotactile stimulations in place of bulky brail.
[More]
Mentor Graphics Corp. today announced that SilabTech Pvt. Ltd. has achieved first silicon success for their latest 28nm high-speed, mixed-signal PHY IPs for PCI Express, SATA, MIPI, M-PHY and USB 3.0 in advance of the planned schedule.
[More]
Oven Industries Inc. announces new laboratory temperature controllers with ramp/soak capabilities. The 5R6-900 benchtop controller has many outstanding user-friendly benefits. Contained all in one enclosure, the device can be plugged into the wall as a self-contained temperature control system, which has its own power supply. This distinctive detail makes the device unique, as well as highly convenient for users.
[More]
Xenon Corporation, the world leader in pulsed light technology, today announced that three new laboratories have joined the Printed Electronics Test Center Network, bringing the total of participating labs to 25 worldwide. "This is another indication that PE is rapidly becoming a commercial industry, driven by efforts like those of the Test Center Network," said Lou Panico, CEO of Xenon.
[More]
OPEL Technologies Inc. ("OPEL" or "the Company") announces that it has made significant progress in rehabilitating OPEL's research and development facilities located in Storrs, Ct. following the extensive damage caused by Hurricane Sandy.
[More]
Semiconductor Manufacturing International Corporation ("SMIC";), mainland China's largest and most advanced semiconductor foundry, today announced that it entered into the Joint Venture Agreement with SMIC Beijing, BIDIMC and ZDG in relation to the establishment of the Joint Venture Company (subject to the approval of the relevant PRC authorities).
[More]
Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the availability of a comprehensive design implementation solution for the Samsung 14LPE FinFET process.
[More]
Smithers
Rapra Publishing has announced the release of Update on Nanofillers
in Nanocomposites: From Introduction to Application.
Polymer nanocomposites continue to receive widespread acclaim for
their potential to...
[More]