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Oxford Instruments and Lancaster University to Develop Ultra Low Temperature Systems for Quantum Sensors with UK Funding

Oxford Instruments and Lancaster University to Develop Ultra Low Temperature Systems for Quantum Sensors with UK Funding

Quantum technologies are poised to revolutionise our daily lives in the future, just as the semiconductor revolution did starting some fifty years ago. The UK Government has identified quantum technologies as a strategic area for investment, launching the £270 million ‘UK National Quantum Technologies Programme’ in its 2013 autumn statement. [More]
Entegris Releases Torrento X Series 7nm Filters with FlowPlane Linear Filtration Technology

Entegris Releases Torrento X Series 7nm Filters with FlowPlane Linear Filtration Technology

Entegris, Inc., a leader in yield-enhancing materials and solutions announced today the release of Torrento® X Series 7 nm filters with FlowPlane™ linear filtration technology. FlowPlane is the semiconductor industry's first scalable, linear, high-flow filtration platform enabling advanced wet cleaning applications for the 10 nm node and beyond. The first in a series of filters based on the linear filtration technology, the FlowPlane S model is designed for point of dispense (POD) applications, enabling improvements in both on-wafer defectivity and yield for critical wet cleaning applications. [More]
imec Demonstrates Pore-Sealing Low-K Dielectrics in Advanced Interconnects at SEMICON West

imec Demonstrates Pore-Sealing Low-K Dielectrics in Advanced Interconnects at SEMICON West

Nano-electronics research center imec announced today at SEMICON West that it has demonstrated concept and feasibilityfor pore-sealing low-k dielectrics in advanced interconnects. The method, based on the self-assembly of an organic monolayer, paves the way to scaling interconnects beyond N5. [More]
SEMICON WEST 2015: imec and Besi Develop Automated Thermocompression Solution for Narrow-Pitch Die-to-Wafer Bonding

SEMICON WEST 2015: imec and Besi Develop Automated Thermocompression Solution for Narrow-Pitch Die-to-Wafer Bonding

Today, at SEMICON WEST 2015 (San Francisco), world-leading nano-electronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries announced that they have jointly developed an automated thermocompression solution for narrow-pitch die-to-wafer bonding, a method by which singulated dies are stacked onto bottom dies which are still part of a fully intact 300mm wafer. The solution features high accuracy and high throughput, paving the way to a manufacturable 2.5D, 3D, and 2.5D/3D hybrid technology. [More]
CEA-Leti Announces Feasibility of CoolCube in FinFET Technology on 300mm Production Line

CEA-Leti Announces Feasibility of CoolCube in FinFET Technology on 300mm Production Line

CEA-Leti today announced its first results towards the demonstration of CoolCube’s feasibility in FinFET technology on its 300mm production line, and new CoolCubeTM circuit designs that improve the trade off between area, speed and power. [More]
Applied Materials Introduces Centris Sym3 Etch System with New Chamber for Atomic-Level Precision Manufacturing

Applied Materials Introduces Centris Sym3 Etch System with New Chamber for Atomic-Level Precision Manufacturing

Applied Materials, Inc. today announced a next-generation etch tool, the Applied Centris(TM) Sym3(TM) Etch system, featuring an entirely new chamber for atomic-level precision manufacturing. To overcome within-chip feature variations, the Centris Sym3 system leapfrogs current tools to provide chipmakers with the control and precision needed to pattern and create densely packed 3D structures in advanced memory and logic chips. [More]
Applied Microstructures Announces Milestone Shipment of 100th Molecular Vapor Deposition Tool

Applied Microstructures Announces Milestone Shipment of 100th Molecular Vapor Deposition Tool

Marking an important milestone for its Molecular Vapor Deposition (MVD®) technology, Applied Microstructures (AMST) today announced that it will ship its 100th tool to a semiconductor manufacturer in Asia next week. AMST technology and equipment is used to volume-produce MEMS devices found in smartphones, computers, automobiles, and products that enable the Internet of Things (IoT). [More]
GLOBALFOUNDRIES Debuts 22nm 2D FD-SOI Technology for Ultra-Low-Power Requirements

GLOBALFOUNDRIES Debuts 22nm 2D FD-SOI Technology for Ultra-Low-Power Requirements

GLOBALFOUNDRIES today launched a new semiconductor technology developed specifically to meet the ultra-low-power requirements of the next generation of connected devices. The “22FDX™” platform delivers FinFET-like performance and energy-efficiency at a cost comparable to 28nm planar technologies, providing an optimal solution for the rapidly evolving mainstream mobile, Internet-of-Things (IoT), RF connectivity and networking markets. [More]
Applied Materials Debuts High-Performance ALD System for 3D Memory and Logic Chips Manufacturing

Applied Materials Debuts High-Performance ALD System for 3D Memory and Logic Chips Manufacturing

Applied Materials, Inc. today unveiled the Applied Olympia(TM) ALD system featuring a unique, modular architecture that delivers high-performance ALD technology to manufacturers of leading-edge 3D memory and logic chips. The 3D device inflection is driving growth in ALD with demand for new patterning films, new conformal materials and lower thermal budgets. [More]
STMicroelectronics and French Institute of Materials, Microelectronics and Nanosciences Launch Joint Research Laboratory

STMicroelectronics and French Institute of Materials, Microelectronics and Nanosciences Launch Joint Research Laboratory

Building on many years of close collaboration and numerous joint research programs, STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and the French Institute of Materials, Microelectronics and Nanosciences in Provence (IM2NP - CNRS / Aix-Marseille University / University of Toulon / ISEN engineering school), member of the Carnot STAR (Science and Technology for Research Applications) Institute, have announced the official launch of a new joint research laboratory to develop the next generations of high-reliability, ultra-miniaturized electronic components. [More]