Silex Microsystems, the world's largest pure-play MEMS foundry, and BroadPak, a leading provider of ultra-high performance 2.5D silicon interposer and 3D integration technologies, today announced the immediate availability of their jointly developed silicon interposer solution in high-volume manufacturing.
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STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has begun working with research partners to develop a pilot line for next-generation MEMS devices augmented with advanced technologies such as piezoelectric or magnetic materials and 3D packaging.
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Leading semiconductor test equipment supplier Advantest Corporation has entered the high-growth market for testing micro-electromechanical system (MEMS)-based sensors by installing V93000 Smart Scale™ systems at several of Freescale Semiconductor's facilities around the world.
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The FemtoTools FT-WMS01 Modular Mechanical Testing Software allows users to take real control over their micromechanical testing. Using simple drag-and-drop actions, the development of customized, automated micromechanical testing programs for the testing of microstructures, such as MEMS chips, becomes possible for the first time.
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SiTime Corporation, the fastest growing semiconductor company, today introduced the SiT15xx family of 32 kHz MEMS oscillators that replace legacy quartz crystal resonators. This new family is targeted at mobile applications, such as smartphones and tablets, which require small size and low power.
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Integrated Device Technology, Inc. (IDT®), the Analog and Digital Company™ delivering essential mixed-signal semiconductor solutions, today announced the industry’s first differential MEMS oscillators with 100 femtosecond (fs) typical phase jitter performance and integrated frequency margining capability.
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Northrop Grumman Corporation is introducing its new LCR-200 Attitude and Heading Reference System (AHRS), based on micro-electromechanical systems (MEMS) technology, at the Aircraft Electronics Association's International Convention and Trade Show, which takes place in Las Vegas from March 25-28.
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STMicroelectronics and CMP (Circuits Multi Projets®) today announced that ST's THELMA MEMS manufacturing process, the process ST uses for its industry-leading accelerometers and gyroscopes, which have shipped in billions of units, is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.
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Nanoplas, a global supplier of plasma processing equipment to the semiconductor industry, today announced a new dry-etch process offering virtually unlimited etch selectivity for removing dielectric films on microproc...
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EXFO Inc. announced today that it will be attending OFC/NFOEC 2013, March 17-21, 2013, in Anaheim, California, in order to demonstrate its test solution for deploying, validating and troubleshooting networks up to 100G in the field.
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