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TSMC Certifies Cadence Digital and Custom/Analog Tools for 10nm FinFET DRM and SPICE Models

TSMC Certifies Cadence Digital and Custom/Analog Tools for 10nm FinFET DRM and SPICE Models

Cadence Design Systems, Inc. today announced that its digital and custom/analog tools have achieved certification from TSMC for its most current version of 10-nanometer (nm) FinFET Design Rule Manual (DRM) and SPICE models. [More]
ATopTech Continues Collaboration with TSMC to Certify Aprisa, Apogee Solutions for 10nm Process Technology

ATopTech Continues Collaboration with TSMC to Certify Aprisa, Apogee Solutions for 10nm Process Technology

ATopTech, the leader in next generation physical design solutions, is collaborating with TSMC to certify Aprisa™ and Apogee™, ATopTech’s place and route solutions, for TSMC 10nm process technology. [More]
Mentor Graphics and TSMC Reach First Milestone in 10nm EDA Certification Collaboration

Mentor Graphics and TSMC Reach First Milestone in 10nm EDA Certification Collaboration

Mentor Graphics Corp. today announced that TSMC and Mentor Graphics have reached the first milestone of their collaboration on 10nm EDA certification. Calibre® physical verification and design for manufacturing (DFM) platform, and the Analog FastSPICE™ (AFS™) Circuit Verification Platform, including AFS Mega, are certified by TSMC based on the most current version of 10nm design rules and SPICE models. [More]
Synopsys Design Tools Receive TSMC Certification for 16nm FinFET Plus Production and 10nm Early Design Starts

Synopsys Design Tools Receive TSMC Certification for 16nm FinFET Plus Production and 10nm Early Design Starts

Synopsys, Inc. today announced that TSMC has concluded 16-nanometer FinFET Plus (16FF+) v1.0 certification and reached the first milestone of 10-nanometer (nm) certification based on the most current DRM and SPICE model on a comprehensive list of Synopsys' custom and digital design tools. [More]
ANSYS RedHawk and Totem Products Receive TSMC Certification for 10nm FinFET DRM and SPICE Models

ANSYS RedHawk and Totem Products Receive TSMC Certification for 10nm FinFET DRM and SPICE Models

ANSYS, Inc. announced today that its ANSYS® RedHawk™ and ANSYS Totem™ products are certified by TSMC for the most current version of 10-nanometer (nm) FinFET Design Rule Manual (DRM) and SPICE models, addressing the power and performance requirements for mobile, computing and networking applications. [More]
KaiStar Places Order for Multiple Veeco TurboDisc® EPIK700 GaN MOCVD Systems

KaiStar Places Order for Multiple Veeco TurboDisc® EPIK700 GaN MOCVD Systems

Veeco Instruments Inc. announced today that KaiStar Lighting Co., Ltd., based in Xiamen, China has ordered multiple TurboDisc® EPIK700™ Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) systems. [More]
TSMC 2015 Technology Symposium: Silvaco to Showcase Reliability Solutions from TCAD to Verification

TSMC 2015 Technology Symposium: Silvaco to Showcase Reliability Solutions from TCAD to Verification

Silvaco to showcase Reliability Solutions from TCAD to Verification, Custom Design Flow and SPICE Modeling Solutions for IoT Applications, Advanced Node-Ready SPICE Simulator at TSMC 2015 Technology Symposium. [More]
TSMC 2015 Technology Symposia: Kilopass to Highlight Antifuse NVM IP

TSMC 2015 Technology Symposia: Kilopass to Highlight Antifuse NVM IP

Kilopass Technology, Inc. Will Showcase IP's Ultra Low-Power, Fast Access Speed, Megabits of Capacity, 10 Years of Data Retention, Flexible Programming Options. [More]
Nano-GaN Power Electronic Devices Project Secures €1 Million in Funding

Nano-GaN Power Electronic Devices Project Secures €1 Million in Funding

Tyndall National Institute has partnered with US and Northern Irish research institutes to secure €1 million in funding to develop new ways of harnessing converted electricity. The Nano-GaN Power Electronic Devices project has the potential to have a global impact across the entire power electronics industry. [More]
Rudolph Receives Multi-Million Dollar Orders for NSX® Series and Wafer Scanner™ Inspection Systems

Rudolph Receives Multi-Million Dollar Orders for NSX® Series and Wafer Scanner™ Inspection Systems

Rudolph Technologies, Inc. announced today that a major semiconductor foundry and a top outsourced semiconductor assembly and test (OSAT) facility have placed multi-million dollar orders totaling approximately $17 million for several NSX®Series and Wafer Scanner™ inspection systems. [More]