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Simple Solution Processing Method for Growth of Well-Aligned Single-Crystals of Organic Semiconductors

Simple Solution Processing Method for Growth of Well-Aligned Single-Crystals of Organic Semiconductors

Field-effect transistors (FETs) made of organic single crystals show superior mobility values as organic single crystals have fewer structural defects than their amorphous and polycrystalline counterparts. However, single-crystal devices are practically difficult to fabricate. [More]
National Graphene Institute Hosts Workshop for Standardising Graphene

National Graphene Institute Hosts Workshop for Standardising Graphene

The National Physical Laboratory and The University of Manchester have collaborated by conducting the Graphene UK Standardisation Workshop at the National Graphene Institute (NGI) in order to guide commercial organisations with regards to graphene standardisation. [More]
Juniper Networks Introduces PTX1000 3Tbps Fixed Configuration Core Router with 28nm Chip

Juniper Networks Introduces PTX1000 3Tbps Fixed Configuration Core Router with 28nm Chip

Juniper Networks, the leader in network innovation, today expanded its Converged Supercore?architecture with the introduction of the PTX1000, the industry? most compact 3 Tbps fixed configuration core router. [More]
X-FAB Introduces Cost-Efficient 180nm SOI Technology for Automotive, Industrial Applications

X-FAB Introduces Cost-Efficient 180nm SOI Technology for Automotive, Industrial Applications

X-FAB Silicon Foundries, the leading More than Moore foundry, today announced the industry? first cost-efficient 180nm SOI technology for automotive and industrial applications that need to operate in harsh environments. [More]
Better Understanding of How Heat is Transported through Nanometer-Scale Materials

Better Understanding of How Heat is Transported through Nanometer-Scale Materials

A growing interest in thermoelectric materials ?which convert waste heat to electricity ?and pressure to improve heat transfer from increasingly powerful microelectronic devices have led to improved theoretical and experimental understanding of how heat is transported through nanometer-scale materials. [More]
Cadence, Applied Materials Collaborate to Optimize CMP Process for Advanced-Node 14nm Designs

Cadence, Applied Materials Collaborate to Optimize CMP Process for Advanced-Node 14nm Designs

Cadence Design Systems, Inc. and Applied Materials, Inc. today announced the companies are collaborating on a development program to optimize the chemical-mechanical planarization (CMP) process through silicon characterization and modeling for advanced-node designs at 14 nanometer (nm) and below. [More]
Inkjet Technology for Printing Electronic Nanomaterials onto Flexible Substrates

Inkjet Technology for Printing Electronic Nanomaterials onto Flexible Substrates

Researchers at Binghamton University are focusing on printed electronics: using inkjet technology to print electronic nanomaterials onto flexible substrates. When compared to traditional methods used in microelectronics fabrication, the new technology conserves material and is more environmentally friendly. [More]
Quantum Effect Found in Atomically Thin Diode

Quantum Effect Found in Atomically Thin Diode

Researchers at Penn State, UT-Dallas, Institute of Atomic and Molecular Sciences, and King Abdullah University of Science and Technology, have found that a novel quantum mechanical transport phenomenon demonstrated at room temperature in an atomically thin layered material could help develop new nanoelectronic devices and circuits. [More]
UMC and ARM Collaborate to Tape out PQV Test Chip on 14nm FinFET Technology

UMC and ARM Collaborate to Tape out PQV Test Chip on 14nm FinFET Technology

United Microelectronics Corporation, a leading global semiconductor foundry, today announced it has collaborated with ARM to tape out a process qualification vehicle (PQV) test chip on UMC's 14nm FinFET technology to help validate an ARM Cortex-A family core on the advanced foundry process node. The 14nm cooperation expands on the two companies' successful effort to develop and offer ARM Artisan® Physical IP on UMC's volume production 28nm High-K/Metal Gate process. [More]
UMC, Synopsys Collaborate to Develop Second UMC 14nm Process Qualification Vehicle

UMC, Synopsys Collaborate to Develop Second UMC 14nm Process Qualification Vehicle

Synopsys, Inc. and United Microelectronics Corporation today announced an expanded collaboration to include Synopsys DesignWare® Embedded Memory IP and the DesignWare STAR Memory System® test and repair solution on UMC's second 14-nanometer (nm) FinFET process qualification vehicle (PQV). [More]