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Attopsemi Adopts ProPlus Design Solutions' GigaSpice Simulator for Giga-Scale Circuit Simulation

Attopsemi Adopts ProPlus Design Solutions' GigaSpice Simulator for Giga-Scale Circuit Simulation

ProPlus Design Solutions, Inc. today announced Attopsemi Technology Co., of Hsinchu, Taiwan, developer of state-of-art logic-compatible one-time-programmable (OTP) memory intellectual property (IP), has adopted its high-capacity, high-performance parallel GigaSpice simulator for giga-scale circuit simulation. [More]
Altera Releases Industrial Functional Safety Data Package (Ver. 3) for FPGA Designs

Altera Releases Industrial Functional Safety Data Package (Ver. 3) for FPGA Designs

Altera Corporation today announced the availability of the latest version of its Industrial Functional Safety Data Package (Ver. 3), for systems designers using Altera field programmable gate arrays (FPGAs). The safety pack provides TUV Rheinland-certified toolflows, IP and devices including Cyclone V FPGAs, enabling faster time for market for industrial safety solutions to IEC 61508 up to Safety Integrity Level 3 (SIL3). [More]
X-FAB Partners with Exagan to Industrialize Technology for GaN-on-Silicon Devices on 200mm Wafers

X-FAB Partners with Exagan to Industrialize Technology for GaN-on-Silicon Devices on 200mm Wafers

X-FAB Silicon Foundries and Exagan, a start-up innovator of Gallium Nitride (GaN) semiconductor technology that enables smaller and more efficient electrical converters, have entered into a joint development agreement to industrialize Exagan’s GaN-on-silicon technology, begin producing high-speed power switching devices on 200mm wafers and establish a European production center where the two partner companies will manufacture GaN devices for the solar, industrial, automotive, IT electronics and other markets. [More]
CAP-XX Introduces Thinline Supercapacitors with Unique Nanotechnology Construction

CAP-XX Introduces Thinline Supercapacitors with Unique Nanotechnology Construction

CAP-XX, developer of flat supercapacitors for burst and back-up power in space-constrained electronic devices, today launched its Thinline series of single-cell supercapacitors. The world's thinnest at 0.6mm thick, and with prices starting at less than US$1 in large volumes, Thinline was developed to address the size, weight and cost challenges of designing thin, sometimes disposable electronic devices for the Internet of Things (IoT). [More]
ARM and UMC Offer Artisan Physical IP Solution on 55nm

ARM and UMC Offer Artisan Physical IP Solution on 55nm

ARM and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced the availability of a new ARM® Artisan® physical IP solution on 55nm to accelerate the development of ARM processor-based embedded systems and Internet of Things (IoT) applications. [More]
Ultra-Low Power Sensor Monitors Health Using Nano-Transistors

Ultra-Low Power Sensor Monitors Health Using Nano-Transistors

Made from state-of-the-art silicon transistors, an ultra-low power sensor enables real-time scanning of the contents of liquids such as perspiration. Compatible with advanced electronics, this technology boasts exceptional accuracy – enough to manufacture mobile sensors that monitor health. [More]
Researchers Build Nano Memory Cell That Mimicks the Way Human Brain Processes Information

Researchers Build Nano Memory Cell That Mimicks the Way Human Brain Processes Information

Researchers at the MicroNano Research Facility (MNRF) have built the one of the world’s first electronic multi-state memory cell which mirrors the brain’s ability to simultaneously process and store multiple strands of information. [More]
Wearables + Wireless Pavilion to Debut at IEEE MTT-S 2015 International Microwave Symposium

Wearables + Wireless Pavilion to Debut at IEEE MTT-S 2015 International Microwave Symposium

The IEEE MTT-S 2015 International Microwave Symposium (IMS) will debut Microwave Week's first Wearables + Wireless Pavilion featuring emerging wearable electronics that utilize RF and microwave technologies. [More]
Cadence Achieves USB-IF Certification for USB 3.0 Host IP Solution on TSMC 16nm FinFET Plus Process

Cadence Achieves USB-IF Certification for USB 3.0 Host IP Solution on TSMC 16nm FinFET Plus Process

Cadence Design Systems, Inc. today announced that its USB 3.0 host IP solution for TSMC’s 16nm FinFET Plus (16FF+) process is one of the first to pass USB-IF compliance testing and receive USB-IF certification. [More]
ANSYS RedHawk and Totem Receive UMC Certification for 28 and 40-nm Technologies

ANSYS RedHawk and Totem Receive UMC Certification for 28 and 40-nm Technologies

ANSYS simulation tools, which deliver needed accuracy and reduced turnaround time, while ensuring power integrity and electromigration (EM) reliability, have been certified by UMC 28 and 40-nanometer (nm) technologies. [More]
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