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Working OTP Bit Cells Demonstrated by Sidense in TSMC 16nm FinFET Technology

Working OTP Bit Cells Demonstrated by Sidense in TSMC 16nm FinFET Technology

Sidense Corp., a leading developer of non-volatile memory OTP IP cores, today announced that it successfully demonstrated read and write capability for its 1T-OTP bit-cell architecture on test silicon fabricated in a 16nm CMOS FinFET process. [More]
TSMC Employs Cadence Solutions to Speed Up 16nm FinFET Library Characterization Cycle

TSMC Employs Cadence Solutions to Speed Up 16nm FinFET Library Characterization Cycle

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that TSMC has adopted Cadence® solutions for 16nm FinFET library characterization. Developed in collaboration between Cadence and TSMC, the library characterization tool setting is available to TSMC customers for download on TSMC-Online. [More]
ProPlus' BSIMProPlus Modeling Platform Deployed for Samsung Electronics’ 14-nm FinFET SPICE Modeling

ProPlus' BSIMProPlus Modeling Platform Deployed for Samsung Electronics’ 14-nm FinFET SPICE Modeling

ProPlus Design Solutions, Inc. today announced Samsung Electronics has extended its long-term partnership with ProPlus through the deployment of ProPlus' BSIMProPlus modeling platform for its 14-nanometer (nm) FinFET SPICE modeling. [More]
Scientists Use Copper as Catalyst for Production of Silicon Solar Cell Wafer

Scientists Use Copper as Catalyst for Production of Silicon Solar Cell Wafer

In making a solar cell, scientists etch nanoscale spikes into a silicon wafer in order to maximize its surface area and consequently to maximize the amount of sunlight to reach it. Metal particles have been used as a catalyst in this process because etching is much accelerated near metal particles. [More]
Aehr Test Systems Receives Follow-on Order for ABTS System from Leading IC Manufacturer

Aehr Test Systems Receives Follow-on Order for ABTS System from Leading IC Manufacturer

Aehr Test Systems, a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received a follow-on order for its Advanced Burn-in and Test System (ABTS) from a leading manufacturer of advanced logic integrated circuits (ICs) for automotive, embedded processing, digital signal processing and analog applications. [More]
Forecast & Analysis Report on Worldwide Internet of Nano Things Market

Forecast & Analysis Report on Worldwide Internet of Nano Things Market

According to new market report "Internet of Nano Things Market by Communication Type (Short & Long Distance Communication), by Nano Components & Devices (Cameras, Phones, Scalar Sensors, Processors, Memory Cards, Power Systems, Antennas & Transceivers) - Worldwide Forecast & Analysis (2016 - 2020), by MarketsandMarkets, defines and segments the IoNT Market into various sub-segments with in-depth analysis and forecasting of revenues. It also identifies drivers and restraints of this market with insights on trends, opportunities, and challenges. [More]
Himax Imaging to Develop Next Gen Smart Phone Cameras Using TPSCo’s 1.12um-pixel CIS 65nm Process

Himax Imaging to Develop Next Gen Smart Phone Cameras Using TPSCo’s 1.12um-pixel CIS 65nm Process

TowerJazz, the global specialty foundry leader, and TowerJazz Panasonic Semiconductor Co., Ltd. (TPSCo) today announced its first major third party CMOS image sensor (CIS) customer, Himax Imaging, Inc., a subsidiary of Himax Technologies, Inc., that is developing its next generation high end cameras for smart phone applications using TPSCo’s state of the art 1.12um-pixel CMOS image sensor (CIS) 65nm process. [More]
Altera Plans Mil Temp Qualification for 20nm Arria 10 FPGAs and SoCs

Altera Plans Mil Temp Qualification for 20nm Arria 10 FPGAs and SoCs

Altera Corporation today announced military temperature (Mil Temp) qualification plans for its newest 20 nm Arria® 10 FPGAs and SoCs, which will be qualified for extreme temperature environments (-55C to 125C ambient). In addition to the ratings, Altera can provide guidelines on speed grades, protocols, and external memory interfaces best suited to specific applications. [More]
Renesas Develops 40-nm Based RH850/C1x Series 32-bit MCUs for Electric Vehicles

Renesas Develops 40-nm Based RH850/C1x Series 32-bit MCUs for Electric Vehicles

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced the new RH850/C1x Series of 32-bit microcontrollers (MCUs), designed for motor control in hybrid electric vehicles (HEVs) and electric vehicles (EVs). [More]
Novel Prototype Device to Test Compound Semiconductor Nanowires

Novel Prototype Device to Test Compound Semiconductor Nanowires

In the consumer electronics industry, the mantra for innovation is higher device performance/less power. Arun Thathachary, a Ph.D. student in Penn State’s Electrical Engineering Department, spends his days and sometimes nights in the cleanroom of the Materials Research Institute’s Nanofabrication Laboratory trying to make innovative transistor devices out of materials other than the standard semiconductor silicon that will allow higher performance using less power. [More]