Nanoelectronics News RSS Feed - Nanoelectronics

Samsung Electronics Mass Produces 20nm 8Gb DDR4 DRAM

Samsung Electronics Mass Produces 20nm 8Gb DDR4 DRAM

Samsung Electronics Co., Ltd., the world leader in memory technology, today announced that it is mass producing the industry’s most advanced 8-gigabit (Gb) DDR4 memory and 32-gigabyte (GB) module, both of which will be manufactured based on a new 20-nanometer (nm) process technology, for use in enterprise servers. [More]
Synopsys Debuts DesignWare STAR Memory System for Embedded Flash Product

Synopsys Debuts DesignWare STAR Memory System for Embedded Flash Product

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today introduced the DesignWare® STAR Memory System® for Embedded Flash product, the industry's first integrated memory test and repair solution with test algorithms optimized for on-chip embedded flash memories. [More]
IBM's Microelectronics Business to be Acquired by GLOBALFOUNDRIES

IBM's Microelectronics Business to be Acquired by GLOBALFOUNDRIES

IBM and GLOBALFOUNDRIES today announced that they have signed a Definitive Agreement under which GLOBALFOUNDRIES plans to acquire IBM's global commercial semiconductor technology business, including intellectual property, world-class technologists and technologies related to IBM Microelectronics, subject to completion of applicable regulatory reviews. GLOBALFOUNDRIES will also become IBM's exclusive server processor semiconductor technology provider for 22 nanometer (nm), 14nm and 10nm semiconductors for the next 10 years. [More]
Glasgow Nanofabrication Expert Honored with Institute of Physics President’s Medal

Glasgow Nanofabrication Expert Honored with Institute of Physics President’s Medal

Professor Douglas Paul received the Institute of Physics President’s Medal at an event in London today (Wednesday 15 October). [More]
TSMC Honors Cadence with Partner of the Year Awards for Soft IP and 16nm FinFET Plus Solutions

TSMC Honors Cadence with Partner of the Year Awards for Soft IP and 16nm FinFET Plus Solutions

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that it has won two TSMC Partner of the Year awards during the TSMC Open Innovation Platform® (OIP) Ecosystem Forum. Cadence was presented with awards for both Soft IP and joint development of 16nm FinFET Plus (16FF+) design infrastructure. [More]
Trillion Sensors Summit: Thinfilm to Present on Printed Electronics for Sensor Manufacturing

Trillion Sensors Summit: Thinfilm to Present on Printed Electronics for Sensor Manufacturing

Thin Film Electronics ASA (“Thinfilm”), a leader in the development and commercialization of printed electronics, today announced that its chief executive officer, Dr. Davor Sutija, will deliver a talk on the role printed electronics can play in sensor manufacturing at TSensors (Trillion Sensors) Summit San Diego. [More]
Synopsys Honored with TSMC Partner of the Year Award for Interface IP and Joint Development of 16-nm FinFET Plus Design Infrastructure

Synopsys Honored with TSMC Partner of the Year Award for Interface IP and Joint Development of 16-nm FinFET Plus Design Infrastructure

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that TSMC is recognizing Synopsys with their "2014 Partner of the Year" award in the areas of: Interface IP and Joint Development of 16-nm FinFET Plus Design Infrastructure. [More]
ARMv8-A Processor IP to be Optimized for TSMC 10FinFET Process Technology

ARMv8-A Processor IP to be Optimized for TSMC 10FinFET Process Technology

ARM® and TSMC today announced a new multi-year agreement that will deliver ARMv8-A processor IP optimized for TSMC 10FinFET process technology. Because of the success in scaling from 20SoC to 16FinFET, ARM and TSMC have decided to collaborate again for 10FinFET. This early pathfinding work will provide valuable learning to enable physical design IP and methodologies in support of customers to tape-out 10FinFET designs as early as Q4 2015. [More]
CNSE-NIOSH Partnership for Occupational Safety and Health Research Related to Nanoelectronics

CNSE-NIOSH Partnership for Occupational Safety and Health Research Related to Nanoelectronics

As an embodiment of Governor Andrew M. Cuomo’s public-private partnership model for innovation and economic development, the Colleges of Nanoscale Science and Engineering (CNSE) at SUNY Polytechnic Institute (SUNY Poly) today announced a continued and expanded collaboration with the National Institute for Occupational Safety and Health (NIOSH), which will further expand the CNSE-NIOSH Partnership to Advance Research and Guidance for Occupational Safety and Health in Nanoelectronics. [More]
Future Computer Chips Could be Based on 3D Arrangements of Nanomagnets

Future Computer Chips Could be Based on 3D Arrangements of Nanomagnets

Electrical engineers at the Technische Universität München (TUM) have demonstrated a new kind of building block for digital integrated circuits. [More]