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Novavax Presents Preclinical Data on RSV F-Protein Nanoparticle Vaccine Candidate at ICAAC 2014

Novavax Presents Preclinical Data on RSV F-Protein Nanoparticle Vaccine Candidate at ICAAC 2014

Novavax, Inc., a clinical-stage biopharmaceutical company focused on the discovery, development and commercialization of recombinant nanoparticle vaccines and adjuvants, today presented preclinical data demonstrating that antibodies generated to its RSV F-protein nanoparticle vaccine candidate (RSV F vaccine) bind to the site II epitope of the RSV F-protein with a higher affinity than palivizumab (Syangis®) at the 54th Interscience Conference on Antimicrobial Agents and Chemotherapy (ICAAC) in Washington, DC. [More]
eSilicon Adds Altis Semiconductor and TSI Semiconductor to Instant Online MPW Quote System

eSilicon Adds Altis Semiconductor and TSI Semiconductor to Instant Online MPW Quote System

eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today announced the addition of two foundries -- Altis Semiconductor and TSI Semiconductor -- to its automated, instant online quote system for multi-project wafer (MPW) shuttles. The service, accessed through user-friendly web or smartphone interfaces, instantly generates executable MPW quotes. Typically it can take up to a week to get a quote using the traditional manual process. [More]
TSMC Employs Cadence Solutions to Speed Up 16nm FinFET Library Characterization Cycle

TSMC Employs Cadence Solutions to Speed Up 16nm FinFET Library Characterization Cycle

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that TSMC has adopted Cadence® solutions for 16nm FinFET library characterization. Developed in collaboration between Cadence and TSMC, the library characterization tool setting is available to TSMC customers for download on TSMC-Online. [More]
Applied Nanotech, NanoHoldings Combine to Bring Advanced Nanotechnology-enabled Products to Global Marketplace

Applied Nanotech, NanoHoldings Combine to Bring Advanced Nanotechnology-enabled Products to Global Marketplace

PEN Inc. (PEN) today confirmed the closing of the previously announced combination of Applied Nanotech Holdings, Inc. (Applied Nanotech) and NanoHoldings, Inc., the parent company of Nanofilm, Ltd. (Nanofilm), to form the new publicly traded company. Scott Rickert, the CEO of Nanofilm, is now the CEO and Chairman of the Board of Directors of PEN. [More]
Aehr Test Systems Receives Follow-on Order for ABTS System from Leading IC Manufacturer

Aehr Test Systems Receives Follow-on Order for ABTS System from Leading IC Manufacturer

Aehr Test Systems, a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received a follow-on order for its Advanced Burn-in and Test System (ABTS) from a leading manufacturer of advanced logic integrated circuits (ICs) for automotive, embedded processing, digital signal processing and analog applications. [More]
Forecast & Analysis Report on Worldwide Internet of Nano Things Market

Forecast & Analysis Report on Worldwide Internet of Nano Things Market

According to new market report "Internet of Nano Things Market by Communication Type (Short & Long Distance Communication), by Nano Components & Devices (Cameras, Phones, Scalar Sensors, Processors, Memory Cards, Power Systems, Antennas & Transceivers) - Worldwide Forecast & Analysis (2016 - 2020), by MarketsandMarkets, defines and segments the IoNT Market into various sub-segments with in-depth analysis and forecasting of revenues. It also identifies drivers and restraints of this market with insights on trends, opportunities, and challenges. [More]
OCSiAl Enters Into 100kg Supply Agreement with Major Chinese Nanoindustry Company

OCSiAl Enters Into 100kg Supply Agreement with Major Chinese Nanoindustry Company

OCSiAl has entered into a 100-kg supply agreement with one of the key players in Chinese nanoindustry. This outstanding contract adds on recently announced MoU for bulk deal in Korea expanding the presence of SWCNT leading manufacturer in Asia-Pacific. [More]
Three New Products from KLA-Tencor to Support 5D Patterning Control Solution

Three New Products from KLA-Tencor to Support 5D Patterning Control Solution

Today, KLA–Tencor Corporation introduced the WaferSight™ PWG patterned wafer geometry measurement system, the LMS IPRO6 reticle pattern placement metrology system and the K–T Analyzer® 9.0 advanced data analysis system. [More]
Samsung Announces Mass Production of New 20-nm Class Process Technology-based RDIMMs

Samsung Announces Mass Production of New 20-nm Class Process Technology-based RDIMMs

Samsung Electronics, Ltd. announced today that it has started mass producing the industry’s first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) “through silicon via” (TSV) package technology. [More]
EORTC-NCI-AACR Symposium to Feature BIND Therapeutics’ Presentation on Clinical Activity of BIND-014

EORTC-NCI-AACR Symposium to Feature BIND Therapeutics’ Presentation on Clinical Activity of BIND-014

BIND Therapeutics, Inc., a clinical-stage nanomedicine platform company developing targeted and programmable therapeutics called AccurinsTM, announced today that a poster presentation including Phase 2 clinical data on its lead drug candidate, BIND-014, in patients with non-small cell lung cancer (NSCLC) will be presented at the upcoming 26th EORTC-NCI-AACR Symposium on Molecular Targets and Cancer Therapeutics. [More]