Posted in | Nanomaterials

How to Cleave a Wafer into Die Sized Pieces

whole wafer cleaving with LG tools

Starting with a whole wafer, this instructional video shows you how to downsize a wafer into die sized pieces. The process results in high quality, clean samples that can be used for further analysis. The LatticeGear Cleaving Kit (WCSK-102LG) is required to perform this process and the LatticeScriber (LGUS-100) is also useful, having a long life diamond scribe tip designed specifically for semiconductor materials.

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Comments

Yilliang Peng says:

February 23, 2017 at 6:35 PM

I appreciate the video on how to cut a silicon wafer into little-sized pieces! My wife was trying to do it with scissors for the longest time; however, after watching this video, I think she will invest in some more proper tools. I never knew that Could you cut the wafer into other shapes? Thanks for the great information!

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