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The Leica TXP and TIC 3X Sample Preparation Systems

Todd Perez from Leica shows us their sample preparation system that consists of 2 instruments, the TXP mechanical preparation system and the TIC 3X triple ion beam cutting system.

The TXP actually performs 3 functions, it cuts, grinds and polishes all in one machine. It can be operated in either manual or automated modes and is fully controllable. Furthermore it is a fast and efficient, compact unit that avoids the need for a bench full of equipment.

The TIC 3X is a cross-sectional system that provides a wide polished surface. The triple ion beam system is faster than single and double beam systems. It includes a microscope with up to 225 times magnification and a decoupled pump to eliminate vibration. It can be used with either single, multi or cryo (featuring heating or cooling) stages.

The systems are suited to applications such a semiconductors, food and metallography.

Run time - 4:35min

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