Overview of the FEI Vion Plasma FIB
This video shows an overview of Vion Plasma FIB (focused ion beam) from FEI. The system can selectively etch certain materials or deposit patterned insulators and conductors.
High-speed milling and deposition with precise control make the technology appropriate for several tasks such as defect analysis of 3-D chips and MEMS devices, failure analysis of TSVs, bumps, wire bonds, and stacked die and surgically remove package and material to enable failure analysis and fault isolate on buried die.
Run Time – 3:02min