Qualcomm Incorporated
(NASDAQ:QCOM), a leading developer and innovator of advanced wireless technologies,
products and services, today introduced the WCN1312(TM) - a single-chip, high-performance
802.11n-compliant wireless local-area networking (WLAN) solution for handsets
and mobile devices. This highly integrated device supports data rates of up
to 72 Mbps - significantly higher than previous 802.11a, b, and g Wi-Fi solutions
- for a better user experience while downloading data, watching streaming video
or surfing the Internet.
"As demand increases for wireless LAN connectivity in handsets and other
mobile devices, carriers are migrating to higher-performance, more integrated
solutions," said Mike Concannon, senior vice president of Connectivity
and Wireless Modules for Qualcomm CDMA Technologies. "The new WCN1312 solution
gives our customers an extremely compact 802.11n solution with leading-edge
performance and full system-level integration with other Qualcomm chipsets,
which minimizes design time and reduces manufacturers' time-to-market."
The WCN1312 solution offers a high level of integration with a 2.4 GHz 802.11n
baseband processor, media-access controller, RF transceiver, transmit power
amplifier, low-noise amplifier, transmit switch, power coupler and radio-frequency
(RF) bandpass filter all in a small 7x7 mm package. This simplified design eliminates
the need for many external RF components, minimizing the component count and
resulting in a smaller system footprint.
The new WCN1312 chip uses low-power 65nm CMOS technology and advanced power-management
techniques to minimize sleep, standby and active power consumption. It is optimized
for performance with Qualcomm's complete Mobile Station Modem(TM) (MSM(TM))
solutions and supports a variety of mobile operating systems, including Qualcomm's
Brew Mobile Platform(R), Android and Windows Mobile. The WCN1312 chip is the
industry's first mobile handset device to support both 1x1 and 1x2 dual-receive
configurations to increase range and data throughput performance when needed.
The WCN1312 solution also implements advanced coexistence architecture and algorithms
to optimize performance when paired with Qualcomm's Bluetooth(R) solutions.
Scheduled for sampling in the second quarter, the WCN1312 chip is expected to
be in volume production by the fourth quarter of 2009, and is part of a complete
end-to-end solution for 802.11n from Qualcomm, which also includes the WCN1320(TM)
solution for consumer electronic devices.
Qualcomm Incorporated (NASDAQ:QCOM) is a leader in developing and delivering
innovative digital wireless communications products and services based on CDMA
and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm
is included in the S&P 100 Index, the S&P 500 Index and is a 2009 FORTUNE
500(R) company. For more information, please visit www.qualcomm.com.
Except for the historical information contained herein, this news release contains
forward-looking statements that are subject to risks and uncertainties, including
the Company's ability to successfully design and have manufactured significant
quantities of the WCN1312 chip on a timely and profitable basis, the extent
and speed to which 802.11n-compliant wireless local-area networking is adopted
and deployed, change in economic conditions of the various markets the Company
serves, as well as the other risks detailed from time to time in the Company's
SEC reports, including the report on Form 10-K for the year ended September
28, 2008, and most recent Form 10-Q.
Qualcomm is a registered trademark of Qualcomm Incorporated. Mobile Station
Modem, MSM, WCN1312 and WCN1320 are trademarks of Qualcomm Incorporated. All
other trademarks are the property of their respective owners.
Posted June 1st, 2009
