Technic Inc., an international
leader in advanced electroplating process technology, has announced the release
of Technic's Semiplate Cu. Designed for Semiconductor plating applications where
single sided copper electroplating of large areas is required, Semiplate Cu
is a high speed copper plating process capable of depositing copper at 40 -
60 ASF with virtually no internal stress in the deposit. The deposit characteristics
allow for coverage to a single side of the wafer without any undesirable bowing
of the substrate. Technic Semiplate Cu removes the former limitations for large
area copper plating on single sided wafers.
Andy Fioramonti, Technic's Global Product Manager for Semiconductor Products,
stated, "In this challenging global environment, Technic continues to invest
in R&D and bring innovative solutions to market for our customers. Technic
Semiplate Cu is an enabling technology that offers our customers a level of
design flexibility not currently available in today's market."
Technic is a US based, private, financially strong corporation. For over 60
years, Technic has been a global supplier of proprietary chemistries, specialized
custom finishing equipment, engineered powders, and analytical control systems
to the electronic component, printed circuit board, semiconductor, photovoltaic,
and industrial finishing industries.
Posted August 22nd, 2009
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