Semefab (Scotland) Ltd, a leading, independent wafer fab foundry with an
impressive track record of process development, induction and fabrication of
MEMS, CMOS and ASIC technologies, today announced that it will further broaden
its diverse process portfolio with the installation of an EVG520IS semi-automated
wafer bonding system from EV
Group (EVG). Complementing the equipment in its newly opened MEMS fab2 foundry,
the company can now offer customers the widest range of wafer bonding processes
such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding.
In addition, the new EVG bonder will open new markets for Semefab, such as inertia
sensing and wafer scale packaging.
The combined process know-how of both companies as well as joint R&D, pilot
line production and prototype development at EVG's global headquarters in Austria
will allow Semefab to develop and implement innovative, cost effective and high
quality processes with its customers, ranging from start-up companies to established
market leaders in their field.
"The EVG520IS, an ideal solution for small volume production as well
as research & development, suits Semefab's unique approach very well."
said Ian F. McNaught, MEMS Business Manager, Semefab (Scotland) Ltd. "Semefab
occupies a unique market space where we support a MEMS development model and
a MEMS commercial volume foundry model where development projects seamlessly
transfer from development to volume manufacture,"
Paul Lindner, EVG's executive technology director, commented, "The MEMS
community can trust in our ability to meet today's exacting manufacturing requirements,
and we are excited that another leading MEMS foundry has chosen our equipment
for its superior process capabilities, quality and support. The EVG520IS has
been re-designed based on customer feedback as we share a similar philosophy
with Semefab, which we at EVG call invent - innovate - implement."
The production proven EVG520IS wafer bonding system is a flexible, modular
solution for wafers up to 200mm. Combining fully-automated bond process execution
and bond cover movements with manual loading and unloading, the system offers
an integrated, external cooling station for high throughput. It features EVG's
proprietary symmetric rapid heating and cooling chuck design with independent
top and bottom side heater, high pressure bonding capability and the same material
and process flexibility as a manual system.
Posted November 6th, 2009
