EV Group (EVG), a leading
supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology
and semiconductor markets, today announced that they have received an order
for its EVG101D, a photoresist developer, from the University of Tokyo. A first-time
order win from the University, EVG's tool will be installed at a super-clean
room (Class 1) in the Takeda Sentanchi Building at the University's facilities.
A versatile R&D system, the EVG101D augments an existing developer at the
University and will be used to develop 100-nm and smaller patterns on masks
and wafers up to 200 mm at the research facility. The patterns will be created
by e-beam lithography system from the VLSI Design and Education Center (VDEC).
“This developer from EVG will allow us to reduce the amount of chemicals
required in the developing process, and provide an overall cost reduction for
us,” said Professor Yoshio Mita from the University of Tokyo.
“The EVG100 series is a flexible toolset that can be modified to serve
as a spray or spin coater, which is ideal for an R&D environment. Additionally,
this photoresist processing series is capable of coating patterned wafers, which
is suitable for MEMS production,” said Yuichi Otsuka, Representative Director
of EV Group Japan K.K.
The University of Tokyo has established an advanced research facility dedicated
to ultra-fine lithography/nanomeasurement. The sophisticated center makes their
leading-edge R&D tools for nanoprocessing and nanomeasurement available
to public and private companies as well as government institution researchers.
Since its establishment in 2007, these entities have used the center's
high-throughput nanolithography and nano-measurement systems, as well as its
super resolution transmission electron microscope and a variety of manufacturing
systems atypical to semiconductor device production. The facility also provides
foundry and analyses services, with university staff on-hand to support. For
more information, please visit: www.nanotechnet.t.u-tokyo.ac.jp