Taiwan Semiconductor Manufacturing
Company, Ltd. (NYSE:TSM) today announced that it has qualified its new 0.18-micron
embedded flash (embFlash) process technology family that targets a wide range
of applications. The new family includes a baseline 1.8 to 5 volt standard process,
an ultra-low leakage process, and specific automotive-qualified embedded Flash
"This extended featured-rich 0.18-micron embedded flash family demonstrates
the emphasis that TSMC places on serving the analog, power sensitive and automotive
markets. The breadth of applications that this family targets is unprecedented
and reflects the growing market demand for technology that is both broad in
scope, yet precise in its application," said George Liu, director, Mainstream
The baseline 0.18-micron 1.8V/5V embFlash process supports enhanced analog performance
and traditional 5 volt I/O interface applications. The true 5 volt I/Os achieve
better performance in a smaller footprint than similar 5 volt I/Os built on
higher voltage devices.
The process features a single low voltage Flash IP that operates fully functions
at 1.8 volts. Several Flash IP macros and a customization service are available
now. The new process is ideal for large appliance motor controls on refrigerators,
washing machines and air conditioners.
The TSMC 0.18-micron Ultra-Low-Leakage (uLL) embFlash process operates at 1.8V
and features a 95% leakage reduction compared to the baseline process. Built
upon the uLL devices, CPU, standard cell library, and SRAM can save up to 85%,
90%, and 95% standby current respectively compared to the baseline process.
A low power Flash IP supports up to 80% lower standby current and 60% lower
active current with the Flash IP compiler expected to be available in Q3 this
The uLL process is particularly suitable for power-sensitive and portable devices.
The High-Data-Retention (HDR) member of the 0.18-micron embedded flash family
operates at 1.8V/3.3V and has been qualified for automotive quality requirement
AEC-Q100. Extensive test methodology has also been developed to meet the stringent
automotive ppm requirements in powertrain, security systems, body systems, and
The TSMC's 0.18-micron process requires only seven mask layers to implement
the embedded flash features and is now ready for production in Fab 3.