Micralyne Inc., a growing
MEMS and microfluidics foundry, announced today that Project Engineer, Mr. Dean
Spicer, will be speaking next week at The 2009 IEEE International Interconnect
Technology Conference (IITC) on Tuesday, June 2.
Spicer will be presenting on the topic Thin-Layer Au-Sn Solder Bonding Process
for Wafer-Level Packaging, Electrical Interconnects and MEMS Applications. The
results being presented were obtained within a development program for a MEMS-based
memory device. Wafer-to-wafer bonding is a key process in MEMS wafer-level packaging
The developed MEMS wafer bonding process utilizes gold-tin solder electroplating
and provides liquid-proof sealing and multiple reliable electrical connections
between the bonded wafers. The wafer bond can withstand 300ºC and features
a thin bond line (2-3 ?m), high bond strength, excellent bond gap control, and
low stress due to small amount of bonding material.
Micralyne is one of the world’s largest, independent, MEMS development
and MEMS manufacturing service providers. With its headquarters in Edmonton,
Alberta, Canada, Micralyne services a diverse customer base with applications
in, automotive sensors for control systems, lab-on-a-chip devices for drug discovery,
MEMS optical switching and attenuation technology in telecommunication networks,
optical light valves for computer-to-print applications and sensors for a variety
of applications such as oil and gas exploration and chemical analysis.