To gain a better understanding of how new and existing wafer metrology technologies
can be used, modified, or enhanced to measure and improve 3D interconnect processes,
SEMATECH will host a
workshop dedicated to 3D Interconnect Metrology on July 15th in conjunction
with SEMICON West in San Francisco, CA.
To further explore innovative metrology capabilities, workshop participants
will share real metrology results from 3D interconnect processing, discuss metrology
challenges, and define possible solutions for measuring films and high-aspect
ratio features that dominate 3D architectures.
“We must have the 3D tooling infrastructure available and address the
equipment concerns that have to be resolved before volume manufacturing can
take place,” said Andrew Rudack, SEMATECH’s 3D equipment process
engineer and workshop chair. “Through SEMATECH’s 3D Interconnect
program and workshops such as this, attendees can compare progress and develop
an assessment on integration approaches, process architectures, and tool sets
that will make 3D TSVs commercially viable.”
The speaker line-up is as follows:
- Metrology Applications of Enabling Technologies for Wafer Thinning, John
- Scanning Acoustics Microscopy for Metrology of 3D Interconnect Bonded Wafers,
James McKeon, Sonix
- Through-Silicon-Via (TSV) Processes Demand Macroscopic to Microscopic Metrology,
Liam Cunnane, Metryx
- 3D Interconnect Bonded Wafer Pair Metrology Using IR Microscopy, Richard
- A Route Towards Non-Destructive Three-Dimensional CD Measurements of Through-Silicon-Via
with X-ray Computed Tomography, Steve Wang, Xradia
- Optical Metrology for TSV Process Control, Matthew Knowles, Zygo
- Aspect Ratio Independent Non-Contact, High Throughput TSV Depth Metrology
for 3D Interconnect Technology, David Marx, Tamar
The half-day workshop will conclude with a panel discussion entitled “3D
Metrology – Does it Measure Up” that focuses on the readiness of
metrology tools to support 3D integration challenges.
SEMATECH’s 3D program was established to deliver robust 300 mm equipment
and process technology solutions for high-volume through-silicon-via (TSV) manufacturing.
To accelerate progress, the program’s engineers have been working jointly
with chipmakers, equipment and materials suppliers, and assembly and packaging
service companies from around the world on early development challenges, including
cost modeling, technology option narrowing, and technology development and benchmarking.
The SEMATECH 3D program has also been building industry consensus by sponsoring
3D workshops and continued ITRS involvement.
The 3D Interconnect Metrology Workshop is part of the SEMATECH Knowledge Series,
a set of public, single-focused industry meetings designed to increase global
knowledge in key areas of semiconductor R&D. For more information on the
July workshop, including registration and other relevant information, visit
http://www.sematech.org/meetings/announcements/8736/. To see a complete listing
of all the meetings in this series, go to www.sematech.org/meetings/sks.htm.
For over 20 years, SEMATECH® has set global direction, enabled flexible
collaboration, and bridged strategic R&D to manufacturing. Today, we continue
accelerating the next technology revolution with our nanoelectronics and emerging