EV Group (EVG), a leading
supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology
and semiconductor markets, today announced that EPCOS - a leading electronic
components, modules and systems manufacturer - selected EVG's fully automated
GEMINI wafer bonder for high-volume RF components production at EPCOS's production
facility based in Munich, Germany. EPCOS is utilizing EVG's wafer bonder to
manufacture surface acoustic wave (SAW) filters embedded in RF devices for a
variety of applications, including GPS navigation equipment, mobile phones and
home entertainment systems.
"As we continue to innovate and further strengthen our SAW filter product
portfolio, we are looking to partner with equipment suppliers who can address
our stringent performance needs," said EPCOS's Christian Bauer, process
development, SAW components. "Simultaneously, we're also looking for suppliers
that offer flexible solutions along with value-added process expertise that
will enable us to explore emerging markets, such as MEMS. Ultimately, we selected
EVG's GEMINI bonder as it offered us superior process reliability, as well as
throughput and yield in line with our requirements."
Paul Lindner, EVG's executive technology director, noted, "The opportunity
to work closely with EPCOS for its high-volume manufacturing needs has tremendous
significance for EVG. This order win is testament not only to the performance
capabilities of our wafer bonding solutions, but also to the continued inroads
we've made into the high-volume market. We look forward to ongoing opportunities
to work closely together with EPCOS to enable their current and future manufacturing
needs."
EVG's GEMINI platform is a field-proven, production manufacturing solution
for high-volume wafer bonding applications for MEMS, 3D IC integration and advanced
packaging, as well as compound semiconductor applications. With more than 100
automated wafer bonder installations worldwide, the GEMINI is designed for the
lowest total cost of ownership and quickest return on investment. This fully
automated wafer bonding system integrates EVG's precision alignment accuracy
and wafer handling expertise into one wafer bonding platform.