Taiwan Semiconductor Manufacturing
Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that it has released
an enhanced version of its 0.13-micron process to benefit customers' cost and
competition and to enable the integration of power management functions. The
0.13-micron/0.11-micron family now includes a slim standard cell, SRAM and I/O
with substantial area reduction and the 0.13-micron process also adopts LD-MOS
(5V~20V) on RF platforms to enable analog and power management applications.
The slim platform is available in the third quarter this year while the LD-MOS
on RF platforms will be available in Q4 this year.
To meet the ever shrinking requirements for basic consumer and RF applications,
the slim platform I/O area achieves a 30% reduction and SRAM bit cells demonstrate
a 25% reduction when compared with traditional offerings. Furthermore, a 0.13-micron
LD-MOS device built upon a RF platform enables SOC designs with power management
"This is another example of how TSMC is committed to enabling more efficient
SoC design of wireless, consumer and communications devices using 0.13-micron
process technology," said Dr. Simon Wang, senior director of Advanced Technology
Business Division. "The result of these enhancements will spawn the next
generation of innovation," he said.
TSMC's investment in R&D for technology and IP portfolios within the 0.13-micron/0.11-micron
family now delivers a true 5V with Copper interconnect for the integration of
analog, high-speed DSP, power management and watt-scale class-D amplification.
Along with new features development for system-on-chip design, TSMC also offers
a shrunken path to enhance customer's competitiveness including sub-node and
slim technology platform.