Inc. today announced a common laboratory agreement with CEA-Leti, which
maintains one of the world's leading research centers for applied electronics
in Grenoble, France. The agreement marks a major step towards commercialization
of Replisaurus' innovative ElectroChemical Pattern Replication (ECPR™)
metallization process, and allows the company to move full speed ahead as it
prepares to meet the high-volume, short cycle demands of the device interconnect
Under the multi-year agreement, Replisaurus and Leti personnel will collaborate
and take advantage of the lab's extensive manufacturing facilities, experience
in both semiconductor and MEMS technology, and expertise with 200mm and 300mm
wafer technologies. The team will initially focus on optimizing the development
of reusable master electrodes, a key component of the ECPR process which employs
a template to fabricate metal patterns in a single replication step. They will
also investigate the opportunities for ECPR in new applications, notably in
key growth sectors such as integrated passives, copper pillars and 3D integration.
The team will optimize electrode design and fabrication flow for each application
area, ensuring the best yield, endurance and cycle time.
In order to create a platform to build its mastering business, Replisaurus
has started a new company called Replisaurus Mastering, and the program is already
up and running at Leti's facility in Grenoble.
"The mastering process is a central part of our business model and a unique
component of our technology, so Leti's practical, business-oriented approach
to IP rights was a major factor in our decision to partner with them,"
said James Quinn, CEO of Replisaurus. "We are moving forward according
to plans to roll out our technology, and through this partnership Leti will
support us in transferring it to a foundry partner."
The ECPR process reduces metallization complexity and accelerates production
by eliminating many steps from the traditional process. ECPR also provides improved
patterning and significant cost and time savings, with a fab-friendly, environmentally
clean process that doesn't use solvents or strippers. Along with its significant
environmental benefits, ECPR reduces metallization complexity, boosts production
speed, and represents a genuine step forward for the chip industry.
"This new project with Replisaurus is a very exciting challenge as we
help integrate its innovative clean metallization technology into a high-volume
manufacturing solution. All of the necessary technical developments are already
underway, and this collaboration got off to a great start," said Laurent
Malier, general manager of CEA-Leti. "In addition, access to ECPR technology
through this agreement will enable Leti to position itself at the leading edge
of research into advanced interconnect and device packaging technologies for
The development program will explore 3D technology and applications and employ
technology from Replisaurus subsidiary SET, including the FC300, a high-accuracy,
high force device bonder system for die-to-die and die-to-wafer bonding on wafers
up to 300mm.
"CEA-Leti has advanced capabilities with CMOS and MEMS applications that
will be a great testbed for our technology as we look to apply it in other application
areas," said Alan Cuthbertson, vice president of Mastering Technology at
Replisaurus. "We will focus on 200mm silicon and 300mm through this project
and Leti's world-class facility is the perfect place to enhance our technology
for the chip market."