SUSS MicroTec (FWB:SMH)(GER:SMH),
one of the leading suppliers of process and test solutions for microstructuring
applications in semiconductor and related markets, and Thin Materials, a semiconductor
process development company, announced today that they are cooperating on a
temporary bonding solution to be used for challenging thin wafer handling technologies
required for emerging 3D Integration and Packaging technologies. With this cooperation
SUSS MicroTec extends its solution portfolio for temporary bonding and thin
wafer handling.
The temporary bond material of Thin Materials is capable of handling wafer
processing temperatures in excess of 250°C while being able to do a room
temperature de-bond. This simplifies the debond process by eliminating a number
of steps thus saving time and lowering device costs. The Thin Materials process
runs on SUSS MicroTec’s production wafer bonder, XBC300, whose modularity
and high process flexibility can easily be adapted for changing environments
and processed material. The XBC300 temporary bond configurations are available
for development and high volume needs.
“We have been working closely with SUSS MicroTec as one of the leading
experts for 3D integration solutions”, states Dr. Franz Richter, CEO of
Thin Materials AG, “We are looking forward to extending this partnership
and jointly supply our customers with cutting-edge solutions.”
“Thin Materials’ technology for temporary bonding perfectly complements
our process offering portfolio for 3D Integration and Packaging”, confirms
Frank Averdung, President and CEO of SUSS MicroTec “Partnering with Thin
Materials allows us to offer our customers a wide variety of temporary bonding
technologies according to their specific needs.”
Together with its partners 3M, Disco, DuPont, NEXX Systems, Surface Technology
Systems and Thin Materials SUSS MicroTec will host a TSV 3D Integration workshop
introducing solutions for temporary bonding and thin wafer handling on July
15th during SEMICON West, San Francisco, USA.