SUSS MicroTec (FWB:SMH)(GER:SMH),
a leading supplier of process and test solutions for the semiconductor and related
industries, and the Belgian nanoelectronics research center IMEC
have entered a joint development program. Together, they will develop permanent
bonding, temporary bonding and debonding processes for 3D system integration,
including through-silicon-via (TSV) manufacturing.
IMEC will use SUSS MicroTec’s XBC300 production wafer bonder platform
to develop 200 and 300mm permanent metallic interconnect bonding, as well as
temporary bonding and debonding solutions for its 3D-stacked Interconnect and
3D Wafer Level Packaging technology. This universal platform can support a wide
range of materials and processes, and allows debonding dies at room temperature,
which is an important condition for the integration of memory ICs and CMOS image
sensors. The bond cluster also includes a spin coater, a low force bonder and
a plasma chamber.
For its 3D IC technology, IMEC uses a process flow where TSVs are realized
in a single-damascene process that is performed immediately after front-end
and contact processing but prior to processing of the back-end metallization
layers. This process enables small via diameters of 1–5micron. After completion
of the back-end wiring, silicon is removed from the bottom of the substrate
to open the buried TSVs. Dies or wafers subsequently are stacked and interconnected
in a wafer bonding step.
“We are very pleased to co-develop with SUSS MicroTec the processes for
permanent and temporary wafer bonding for our 3D technologies,” said Eric
Beyne, Program Director of IMEC’s Advanced Packaging and Interconnect
Research Centre. “In particular, the debonding and handling of very thin
wafers ranging from 25 to 50micron is an especially challenging and critical
process. We are convinced that the versatility of the SUSS wafer bonding and
debonding tool platform will contribute to bringing 3D integration technology
to maturity.”
“Working with IMEC, a premier research facility, on 300mm 3D development
for temporary and permanent bonding applications is an exciting opportunity
for SUSS MicroTec,“ said Wilfried Bair, General Manager, SUSS MicroTec’s
Bonder Division. “This cooperation is clearly in the path of our strategic
engagement with leading industry partners at the fore-front of development.
The co-development combined with our focus on understanding our customers’
needs will help us to continuously provide state-of-the-art technology and solutions
to our customers today and tomorrow.”