EV Group (EVG) today
announced a joint effort with Applied Materials, Inc. to develop wafer bonding
processes for the manufacture of through-silicon vias (TSVs) in three-dimensional
integrated circuit (3D IC) packaging applications. The two companies will be
working together as members of the EMC-3D Semiconductor 3D Equipment and Materials
Consortium.
Growing consumer demand for smaller, lower-power electronic devices with greater
functionality is driving the need for TSV technology - a new approach to increase
packaging density by vertically stacking chips. However, while conventional
ICs use wafers approximately 750-µm thick, 3D ICs require thinner wafers
of about 100 µm or less. Processed by themselves, these paper-thin wafers
lose structural and edge integrity in high-temperature, high-stress processes
such as metallization, which poses manufacturing challenges and impacts device
reliability. EVG and Applied will work together to address these issues by bonding
temporary carrier wafers to device wafers prior to thinning. The carriers will
support the ultra-thin device wafers during subsequent process steps and can
be removed afterwards.
The collaboration will explore the use of silicon and glass carrier wafers
to determine substrate stability using EVG's wafer bonding and thin-wafer handling
expertise and Applied's advanced etch, CVD, PVD and CMP process systems. The
goal of this effort is to yield baseline processes and recommendations for the
use of carrier-mounted wafers throughout the individual process steps offered
by both parties. Results from the partnership will be shared with EMC-3D member
companies.
"This is a continuation of our strategy to form alliances with leading
equipment suppliers such as EVG to deliver fully-characterized TSV process flows
to accelerate customers' time to market," said Hans Stork, group vice president
and chief technology officer of Applied's Silicon Systems Group. "We look
forward to working with EVG at Applied's Maydan Technology Center in advancing
this disruptive technology and expediting the adoption of TSVs for mainstream
manufacturing."
"We are excited to collaborate with an industry leader like Applied, to
expedite temporary bonding and debonding capabilities for 3D IC development,"
said Markus Wimplinger, Corporate Technology Development and IP Director at
EV Group "As a co-founder of EMC-3D, EVG is committed to the consortium's
mission to develop cost-effective and manufacturable TSVs for advanced semiconductors.
This opportunity to work with Applied complements those efforts and brings us
closer to realizing 3D IC production for our customers."
Applied Materials, Inc. is the global leader in Nanomanufacturing Technology™
solutions with a broad portfolio of innovative equipment, service and software
products for the fabrication of semiconductor chips, flat panels, solar photovoltaic
cells, flexible electronics and energy efficient glass. At Applied Materials,
we apply Nanomanufacturing Technology to improve the way people live. Learn
more at www.appliedmaterials.com.
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor,
MEMS and nanotechnology applications. Through close collaboration with its global
customers, the company implements its flexible manufacturing model to develop
reliable, high-quality, low-cost-of-ownership systems that are easily integrated
into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint
lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners
and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG holds
a leading position in NIL and lithography for advanced packaging and MEMS. Along
these lines, the company co-founded the EMC-3D consortium in 2006 to create
and help drive implementation of a cost-effective through-silicon via (TSV)
process for major ICs and MEMS/sensors. Other target semiconductor-related markets
include silicon-on-insulator (SOI), compound semiconductor and silicon-based
power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates
via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany,
NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's
unique Triple i-approach (invent - innovate - implement) is supported by a vertical
integration, allowing EVG to respond quickly to new technology developments,
apply the technology to manufacturing challenges and expedite device manufacturing
in high volume. More information is available at www.EVGroup.com
* CVD = chemical vapor deposition; PVD = physical vapor deposition; CMP = chemical-mechanical
planarization