Limited and Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330,
NYSE: TSM) today announced that they have agreed to collaborate on 28-nanometer
(nm) process technology targeted for foundry production of Fujitsu Microelectronics'
28nm logic ICs and to jointly develop an enhanced 28nm high-performance process
technology by utilizing TSMC's advanced technology platform. Previously, both
companies announced that Fujitsu Microelectronics will collaborate with TSMC
on 40nm production. This will extend Fujitsu Microelectronics' 40nm collaboration
with TSMC and covers joint development of an optimized 28nm high-performance
process technology. Initial 28nm samples are expected to ship toward the end
This collaborative effort combines Fujitsu Microelectronics' expertise and strength
in advanced high-speed process and low-power design technologies with TSMC's
expertise and strength in power-efficient high- performance logic/SoC process
and leading-edge technology platform that is part of the Open Innovation Platform(TM)
from TSMC. Extending the collaboration to 28nm will provide the opportunity
for both companies to capitalize on a competitive and high-performance 28nm
technology based on TSMC's 28nm technology portfolio that includes high-performance
and low-power applications.
The two companies are also discussing possibilities for collaborating on advanced
packaging that could include joint developments that combine Fujitsu Microelectronics'
strengths in high-performance lead-free and ultra-high-pin count packaging technologies,
with TSMC's strength in chip-package integration and advanced Cu/ELK interconnect.
"We are rapidly progressing in our previously-announced collaboration with
TSMC on 40nm process technology, with several product designs in progress at
present," said Haruyoshi Yagi, Corporate Senior Vice President of Fujitsu
Microelectronics Limited. "With this further agreement with TSMC on 28nm
high-performance process technology development and production, we combine both
companies' strengths to create greater value for our customers, and will further
drive the growth of businesses for TSMC and Fujitsu's ASIC and ASSP (*1) core
"Fujitsu Microelectronics selected TSMC as a partner based in part on TSMC's
unsurpassed record of developing and ramping advanced technologies. The agreement
today is also a vote of confidence in TSMC's technology platforms that include
design related considerations such as design kits, design flows, TSMC and 3rd
party IP; robust device related documentation, processes technology excellence
and backend assembly and test capabilities," said Jason Chen, Vice President,
Worldwide Sales and Marketing, TSMC.