SUSS MicroTec (FWB:SMH)(GER:SMH),
a leading supplier of process and test solutions for semiconductor industry
and related markets, announces the release of the probe station PA300PS 3D geared
for 300mm electrical probing of 3D stacked structures on wafer level and targeted
at the market for 3D integration. The flexible probe station allows for various
engineering and monitoring tests after wafer production as well as before further
stacking steps or final packaging. With the launch of the new tool SUSS MicroTec
supplements its product suite of wafer bonders and lithography equipment for
3D integration.
PA300PS 3D: the worlds first probe station for electrical probing of 3D stacked structures (Photo: Business Wire)
The new PA300PS 3D meets critical test challenges with MicroAlignTM, a special
alignment function for vertical probe card technologies, with Automated Thermal
Management (ATMTM), a system for active thermal compensation at various test
temperatures, and a unique mechanical stability of the chuck system that renders
it possible to introduce SUSS MicroTec’s high performance tests in 3D
testing environments. The functionalities enable a wide temperature range and
allow collection of low signal data in an environment free from electromagnetic
interference (EMI) via ProbeShield Technology. Using high pin count vertical
probe cards, in combination with MicroAlignTM technology, enables damage free
probing of small test pads and minimizes pad probe marks.
Micrometer resolution is guaranteed by the newly developed z-theta chuck stage
assembly also achieving increased thermal and mechanical stability for high
accuracy, low drift and maximum stiffness at high probe forces. The thermal
chuck system together with adjustable probe card levelling provides the highest
planarity and fastest temperature transmission time on the market thus securing
high test effectivity. For maximum operations safety and efficiency the PA300PS
3D additionally offers ContactViewTM technology and iVistaTM microscope visualization
of all ongoing tasks in 3D applications.
“The roadmap of SUSS MicroTec’s Test division clearly meets the
industry’s demands for a test solution for 3D integration”, explains
Wilfried Bair, VP Business Development SUSS MicroTec.
“I am proud that this new testing capability rounds off our product offerings
in 3D integration. This allows us not only to offer an almost complete product
suite from one single source to our customers but also to continue to push technology
development that addresses present and future needs of our customers.