Oerlikon Systems (SWX:OERL),
a leading supplier of PVD sputter systems, is a notable benefactor in the emerging
revival of the semiconductor industry. During this current quarter, key semiconductor
manufacturers in Taiwan, and South East Asia have placed orders for numerous
300mm ClusterLine PVD sputter tools aimed at the packaging market.
“Over the past year we’re enjoyed a consistently high level of
interest in the CLUSTERLINE from many manufacturers around the world,”
explains Andreas Dill, Head of Oerlikon Systems. “And the strong wave
of firm orders confirm that we have the right production solutions for the next
generation of products and also that our industry is showing robust signs of
The CLUSTERLINE 300 cluster tool platform is specifically designed for advanced
packaging and backside metallization applications for wafer sizes up to 300mm.
The newest orders placed with Oerlikon Systems - by leading packaging clients
in Asia - are for systems configured for the production of advanced MEMS, power
ICs and optoelectronic devices. Three of the four clients are established Oerlikon
accounts and the forth client, a first-time customer, put in an order following
a competitive head to head selection process.
“For years, we have focused our efforts in the development and optimization
of innovative production solutions for under bump metallization (UBM), redistribution
layers, backside metallization and ultra thin wafer processing,” adds
Dill. “Our continuous process improvement in this 3rd generation cluster
tool has resulted in a reliable and highly flexible platform with outstanding
cost efficiency - with the remarkably high wafer yields and easy operation.”