Oxford
Instruments Plasma Technology (OIPT), a leading manufacturer of systems
for etch, deposition and thin film growth, is pleased to announce an order from
University of California Santa Barbara, (UCSB) CA, USA for its FlexAL Atomic
Layer Deposition (ALD) tool.
Oxford Instruments’ FlexAL ALD System
The FlexAL is a compact Plasma ALD system that allows the combination of both
plasma and thermal ALD in a single, compact tool making it ideal for leading
edge research. “The UCSB Nanofabrication Facility is excited at the addition
of the Oxford Instruments FlexAL ALD system. This system offers great flexibility
for thermal and plasma-based processes with in-situ diagnostic tools to address
the needs of a diverse optical and electrical device research effort within
our facility. We look forward to working with Oxford Instruments.” comments
Brian Thibeault, UCSB, Dept. ECE.
Chris Hodson, ALD Product Manager at OIPT said, “Oxford Instruments
is pleased that UCSB selected our most
advanced Plasma ALD system for their future research activities in thin film
growth. We are also excited to be
part of the university’s Nanofabrication Facility’s success linking
local nanotechnology companies and
researchers into a chain that stretches across the country. This is our fourth
Plasma ALD system in the NNIN
network.”