SEMATECH, the global
consortium of semiconductor manufacturers, today announced that it has named
Daniel Armbrust to serve as its President and Chief Executive Officer. Armbrust
will succeed Michael R. Polcari, who has been appointed SEMATECH's Chairman
of the Board.
Armbrust, 47, most recently served as Vice President of 300mm Semiconductor
Operation, where he was responsible for the operation of IBM's 300mm fab
in East Fishkill, New York, which develops leading edge technologies with IBM's
alliance partners and manufactures products for IBM and OEM customers. Previously
Armbrust held a variety of positions at IBM related to process development,
manufacturing, and client engagement.
Michael Polcari, SEMATECH's newly appointed Chairman of the Board, said
that the SEMATECH Board selected Armbrust to lead the consortium based on his
track record of leadership and execution in developing leading edge technologies,
directing fab operations, and managing complex alliances.
“Our search for a new leader for SEMATECH was focused and thorough,”
said Polcari. “Dan came to our attention because of his proven ability
to lead top performing teams, his strong credentials in both R&D and manufacturing,
and his experience in driving strategic alliances. Dan has the right blend of
talents for the job, and we are delighted to welcome him to SEMATECH.”
Armbrust said, “SEMATECH is one of the world's leading consortia,
with a proud history, outstanding talent and significant technical innovations
in many of its programs. SEMATECH has played a pivotal role in our industry,
and it's a great honor to join its leadership team and have the opportunity
to build on its success.”
Armbrust will assume his new duties immediately, replacing Michael R. Polcari,
who has been SEMATECH's President and CEO since February 2003. Polcari
succeeds OB Bilous as Chairman of SEMATECH's Board of Directors.