Cadence Design Systems,
Inc. (NASDAQ: CDNS), the leader in global electronic design innovation,
today announced that Applied Micro Circuits Corporation (NASDAQ: AMCC) has selected
the Cadence® Encounter® Digital Implementation (EDI) System for its
large, complex advanced-node designs. EDI System joins other multiprocessing-capable
offerings in the AppliedMicro™ methodology to form a standardized design
infrastructure based set of tools.
“The Cadence EDI System has fast and comprehensive floorplanning capabilities,
advanced node-ready hierarchical design closure, low power and integrated yield
optimization features. We achieved significant area reduction and higher utilizations
on our toughest designs, which were unroutable using our previous methodology,”
said Amal Bommireddy, vice president of engineering at AppliedMicro. “With
our Encounter RTL Compiler global synthesis and Encounter Conformal technology
adoption last year, and EDI System this year, we’re achieving greater
productivity and faster time to market for our area-critical, high connectivity,
advanced digital networking chips. Its innovative floorplan synthesis, multiprocessor
enabled placement, partitioning, budgeting and advanced power planning techniques
brought faster, easier hierarchical design closure.”
Cadence’s Nanoroute routing enabled AppliedMicro to port its design from
a 90-nanometer process technology to 40 nanometers, while addressing advanced
techniques such as multi-cut vias and litho-aware routing.
“Last year, AppliedMicro brought us in to evaluate our Encounter RTL
Compiler and Conformal technologies, which were ideally suited for their needs,”
said David Desharnais, group director of Implementation Product Management at
Cadence. “This year, they decided to conduct a reevaluation of their entire
design flow, to ensure that they were getting the most efficient and robust
digital solution for their complex 40-nanometer designs. The selection of the
Cadence EDI System rounds out AppliedMicro’s design methodology, joining
the Cadence Virtuoso® custom IC solution and Cadence Allegro® PCB and
packaging technology to enable world class design solution for AppliedMicro.”