Inc. (NASDAQ: RTEC), a worldwide leader in process characterization solutions
for the semiconductor manufacturing industry, announced today the receipt of
multiple orders for its latest Explorer® Inspection Cluster from a major
Taiwanese foundry. The orders include new systems as well as upgrades for previously
installed equipment. The Explorer Cluster monitors defectivity in the Chemical
Mechanical Polish (CMP) process module.
The Explorer System utilizes an AXi940™ module to inspect the front side
of the wafer using enhanced capabilities specifically designed to meet the unique
challenges of CMP inspection in a foundry. In addition to helping users solve
CMP process variation challenges, the AXi940 module has the ability to quickly
and automatically create inspection recipes without sample wafers. The time
required for recipe creation is of utmost concern to foundry customers due to
the wide variety of devices that they manufacture.
Scott Balak, Rudolph’s all-surface inspection product manager adds, “The
Explorer System’s new waferless recipe creation capability was a key factor
in this foundry’s purchase decision. With the Explorer Cluster creating
recipes automatically, the customer benefits from both enhanced tool productivity
as well as a more efficient use of their personnel and material.”
The Explorer Inspection Cluster is a modular approach to wafer inspection that
may include one or more inspection modules for the wafer’s front, back
or edge surfaces. Designed for maximum productivity and efficiency, the Explorer
System incorporates up to four load ports using sophisticated queue management
and features Discover® software, an inline defect analysis and data management
system designed to seamlessly handle advanced macro defect inspection results.
When the E30™ (edge) and B30™ (backside) inspection modules are
paired with the AXi940 frontside module, correlation of defect data from all
surfaces provides faster, more efficient response to defectivity issues.