Nanometrics Incorporated (Nasdaq:NANO), a leading supplier of advanced process control metrology systems used primarily in the manufacturing and packaging of semiconductors, solar photovoltaics and high-brightness LEDs, today announced that additional UniFire™ 7900 metrology systems have been delivered and qualified by an existing customer, and are currently in production for high volume manufacturing process control of advanced wafer-level packaging processes.
This multi-system follow-on installation is part of an ongoing program to deploy Nanometrics’ UniFire technology across multiple manufacturing sites. The systems are being used to measure critical dimensions (CD), topography and overlay registration at the 32nm node for die preparation applications.
“This follow-on order further extends the success of the UniFire technology as it transitions from development into high volume production,” commented Bruce Crawford, COO of Nanometrics. “We have worked to seamlessly integrate the UniFire product and personnel, while continually focusing on uninterrupted product development and customer support during the transition. Nanometrics’ technology is gaining acceptance as the tool of choice for complex topography applications in the die metallization segment, where we provide a cost of ownership advantage over competing technologies, backed by our worldwide applications and service organizations.”
The UniFire platform has now been successfully deployed in both front-end-of-line and back-end-of-line semiconductor manufacturing processes, for applications including advanced packaging, lithography, etch, chemical mechanical polishing (CMP) and thin film deposition. The UniFire has unique capabilities for high precision measurement of two-dimensional and three-dimensional structures for depth, critical dimension, profile, and film thickness control for advanced semiconductor manufacturing processes.