CEA-Leti today announced
that it is has opened a complete 300mm fab extension dedicated to 3D-integration
applications. Final equipment installations will continue through to the end
of this year with an inauguration event planned in January, 2011.
The integration line includes lithography, metallization, deep etching, dielectric
deposition, wet etching and packaging tools that will be available for Leti’s
customers and partners around the world.
The line will complement Leti’s 3D-integration toolbox, which already
includes through-silicon vias, alignment, bonding, grinding, thinning, planarization,
bumping, micro-inserts and design capabilities and mixed-signal IC applications.
“Leti is recognized as a key player in 3D integration R&D and this
new line is a vital addition to our continuously expanding 3D capabilities,”
said Laurent Malier, CEO of Leti. “It also will enable us to offer heterogeneous
integration technologies to customers on 200mm and 300mm wafers.”
CEA is a French research and technology public organisation, with activities
in four main areas: energy, information technologies, healthcare technologies
and defence and security. Within CEA, the Laboratory for Electronics & Information
Technology (CEA-Leti) works with companies in order to increase their competitiveness
through technological innovation and transfers. CEA-Leti is focused on micro
and nanotechnologies and their applications, from wireless devices and systems,
to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS)
are at the core of its activities. As a major player in MINATEC campus, CEA-Leti
operates 8,000-m” state-of-the-art clean rooms, on 24/7 mode, on 200mm
and 300mm wafer standards. With 1,200 employees, CEA-Leti trains more than 150
Ph.D. students and hosts 200 assignees from partner companies. Strongly committed
to the creation of value for the industry, CEA-Leti puts a strong emphasis on
intellectual property and owns more than 1,500 patent families.